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Heat radiation structure of direct cooling refrigerator

A technology of heat dissipation structure and refrigerator, which is applied to household refrigerators, coolers, household refrigeration devices, etc., can solve the problems that the heat dissipation area of ​​the condenser 400 cannot be fully ensured, and the heat dissipation efficiency of the condenser 400 is low, so as to improve the heat dissipation efficiency, Effects of improving efficiency and reducing power consumption

Inactive Publication Date: 2005-12-07
LG ELECTRONICS (TIANJIN) APPLIANCES CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0017] Therefore, the heat dissipation area for the heat generated by the condenser 400 cannot be fully ensured, resulting in low heat dissipation efficiency of the condenser 400

Method used

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  • Heat radiation structure of direct cooling refrigerator
  • Heat radiation structure of direct cooling refrigerator
  • Heat radiation structure of direct cooling refrigerator

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0047] Such as image 3 As shown, the heat dissipation structure of the direct cooling refrigerator of the present invention includes: an outer shell 100, an inner shell 200, a condenser 400 and a radiator 500; the outer shell 100 forms the appearance of the refrigerator; the inner shell 200 is arranged on the outer shell 100 ; the condenser 400 is arranged on the inner surface of the rear wall of the casing 100 ; the radiator 500 is arranged on the outer surface of the rear wall of the casing 100 .

[0048] The heat sink 500 includes several cooling fins 510, and the cooling fins 510 are evenly spaced and arranged in parallel.

[0049] The heat sink 510 on the heat sink 500 is formed on the outer surface of the rear wall of the housing 100 , so as to increase the area of ​​the heat sink in contact with the condenser 400 .

[0050] In addition, the heat sink 510 is longitudinally disposed on the casing 100 .

[0051] The reason why the cooling fins 510 are vertically arrange...

Embodiment 2

[0056] Such as Figure 4 As shown, the heat dissipation structure of the direct cooling refrigerator of the present invention includes: an outer shell 100, an inner shell 200, a condenser 400 and a radiator 500; Inside the recessed portion 520 .

[0057] The cross-section of the recessed part 520 is arc-shaped, and the recessed part 520 surrounds a part of the outer circumferential surface of the condenser 400 .

[0058] The recessed portion 520 is formed on the inner surface of the rear wall of the casing 100 , and several recessed grooves 530 are formed therein.

[0059] The concave portion 520 on the housing 100 is formed by stamping process.

[0060] The reason for making the inner surface of the rear wall of the casing 100 to surround a part of the outer circumference of the condenser 400 is to increase the heat dissipation area for dissipating the heat generated by the condenser 400 .

[0061] In the prior art, since the contact form between the shell 100 and the cond...

Embodiment 3

[0067] Such as Figure 5 As shown, the heat dissipation structure of the direct cooling refrigerator of the present invention includes: an outer shell 100, an inner shell 200, a condenser 400 and a recess 520; the outer shell 100 forms the appearance of the refrigerator; the inner shell 200 is arranged on the outer shell The interior of the enclosure; the condenser 400 is disposed on the inner surface of the rear wall of the casing 100; the recess 520 is formed on the casing 100 for placing the condenser 400.

[0068] The cross-section of the recessed part 520 is arc-shaped, and the recessed part 520 surrounds a part of the outer circumferential surface of the condenser 400 .

[0069] The recessed part 520 is formed on the inner surface of the rear wall of the casing 100 , and several recessed grooves 530 are formed therein.

[0070] The concave portion 520 on the housing 100 is formed by stamping process.

[0071] The heat dissipation structure in Embodiment 3 is basically ...

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PUM

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Abstract

This invention discloses a heat releasing structure of direct freezing refrigerator, which comprises housing, inner casing, chiller and radiator, wherein the inner casing is inside the casing, and the chiller is in the inner side of the back side of the casing; the radiator is set in the outer surface of the casing back side. Said structure increases the heat releasing area and enhances the releasing efficiency, by which it can increase the efficiency of the whole cooling cycle system and decrease the power consumption of the refrigerator.

Description

technical field [0001] The invention relates to a refrigerator, in particular to a heat dissipation structure of a direct cooling refrigerator. Background technique [0002] Generally speaking, a refrigerator is a refrigeration cycle that repeatedly compresses, condenses, expands, and evaporates through a refrigerant to keep the internal space of the refrigerator at a low temperature so that food can be kept fresh for a long time. It is a daily necessities. . [0003] The refrigeration circulation system of the refrigerator mainly includes: a compressor, a condenser, a capillary tube and an evaporator; The function of the condenser is to exchange heat between the high-temperature / high-pressure gaseous refrigerant from the compressor and the outside air to cool / condense it and convert it into a liquid refrigerant with a temperature of 40°C and a pressure of 9 atmospheres; The diameter of the capillary is smaller than that of other parts, so the capillary can reduce the pres...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): F25D23/00
Inventor 河三哲金贤申宗民江成希黄俊贤金宗权
Owner LG ELECTRONICS (TIANJIN) APPLIANCES CO LTD