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Methods and apparatus for electrical, mechanical and/or chemical removal of conductive material from a microelectronic substrate

A technology of conductive materials and microelectronics, which can be used in grinding devices, circuits, electrical components, etc., and can solve problems such as residual conductive material islands.

Inactive Publication Date: 2005-12-07
MICRON TECH INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

A disadvantage of this device is also that islands of conductive material remain on the wafer

Method used

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  • Methods and apparatus for electrical, mechanical and/or chemical removal of conductive material from a microelectronic substrate
  • Methods and apparatus for electrical, mechanical and/or chemical removal of conductive material from a microelectronic substrate
  • Methods and apparatus for electrical, mechanical and/or chemical removal of conductive material from a microelectronic substrate

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Embodiment Construction

[0031] The present disclosure describes methods and apparatus for removing conductive material from microelectronic substrates and / or substrate assemblies used in the manufacture of microelectronic devices. The term conductive material as used in this application includes, but is not limited to, metals such as copper, platinum and aluminum and semiconductor materials such as doped polysilicon. Numerous specific details of certain embodiments of the invention are disclosed in the following specification and appended Figure 3-14B , so that these embodiments can be fully understood. However, one of ordinary skill in the art will appreciate that the present invention has other embodiments, or that the present invention can be practiced without several of the details described below.

[0032] image 3 is a partially schematic side view of an apparatus 160 for removing conductive material from a microelectronic substrate or substrate assembly 110 in accordance with one embodiment...

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Abstract

Methods and apparatuses for detecting characteristics of a microelectronic substrate. A method in accordance with an embodiment of the invention includes positioning the microelectronic substrate proximate to and spaced apart from the first and second spaced apart electrodes, contacting the microelectronic substrate with a polishing surface of a polishing medium, removing conductive material from the microelectronic substrate by moving the substrate and / or the electrodes relative to each other while passing a variable electrical signal through the electrodes and the substrate, and detecting a change in the variable electrical signal or a supplemental electrical signal passing through the microelectronic substrate. The rate at which material is removed from the microelectronic substrate can be changed based at least in part on the change in the electrical signal.

Description

[0001] Cross References to Related Applications [0002] This application is a continuation-in-part of U.S. Application 09 / 651779 (Attorney Docket No. 108298515US), filed August 30, 2000, entitled "Methods and Apparatus for Removing Conductive Material From a Microelectronic Substrate" (Attorney Docket No. 108298515US), June 2001 The U.S. application 09 / 887767 (Proxy Docket No. 108298515US2) filed on June 21, 2001, entitled "Microelectronic SubstrateHaving Conductive Material With Blunt Cornered Apertures, and Associated Methods for Removing Conductive Material", was filed on June 21, 2001 as "Methods and Apparatus for Electrically and / or Chemically-Mechanically Removing Conductive Material From a Microelectronic Substrate" US Application 09 / 888002 (Attorney Docket No. 108298515US3), all of which are incorporated herein by reference in their entirety. technical field [0003] The present invention relates to methods and apparatus for removing conductive materials from microele...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B24B37/04H01L21/321
Inventor W·李S·G·米克尔S·E·穆尔T·T·多恩
Owner MICRON TECH INC