System and method for checking wiring across crack on main machine board

Abstract

The present invention is wiring check system and method for cross split in mainbaord. The system includes one computer, one database and one connector. The computer includes one programmable wiring check device for creating wiring check range, obtaining and judging wiring information, reference information of the wiring layer, perforating information, same voltage shape information and capacitance information, judging whether to have wire crossing with the shape in the reference layer, and accepting qualified wiring information and returning error wiring information. The programmable wiring check device includes one wiring shape creating module, one wiring information judging module, one perforating information judging module, one capacitance information judging module and one shape information judging module. The present invention makes it possible to utilize computer system in automatic check wiring of mainboard.

Description

【Technical field】 [0001] The invention relates to a system and method for checking the rationality of wiring on a motherboard, in particular to a system and method for checking wiring factors that may cause electromagnetic interference (EMI) in the case of wiring across cracks on the motherboard. 【Background technique】 [0002] Printed Circuit Board (PCB) appears in almost every electronic device. If there are electronic parts in a piece of equipment, they are embedded on PCB boards of various sizes. In addition to fixing various small parts, the main function of the PCB board is to provide electrical connections between various parts. As electronic devices become more and more complex, more and more parts are required, and the lines and parts on the PCB are becoming more and more dense. The substrate of the printed circuit board itself is made of insulating and heat-insulating materials that are not easily bent. The small circuit material that can be seen on the surface ...

AI Technical Summary

Problems solved by technology

[0004] The traditional inspection of motherboard wiring generally uses manual operations. However, manual inspection of motherboard wiring has the disadvantage of inaccurate inspection, which makes it impossible to completely solve the EMI problem on the motherboard, and requires a lot of labor costs.

In order to overcome the deficiencies of the above-mentioned prior art, it is necessary to provide a wiring inspection system and method across the cracks on the motherboard, which can automatically conduct various factors that may cause EMI problems in the case of wiring on the motherboard through a computer system. Check to avoid various hidden dangers that may cause EMI problems during the motherboard design and wiring stage

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