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Optoelectronic package and fabrication method

A packaging, optoelectronic technology, applied in optical components, electrical components, electro-solid devices, etc., can solve problems such as high labor costs

Inactive Publication Date: 2006-01-18
GENERAL ELECTRIC CO
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

Traditional methods have included active component alignment with little or no automation, resulting in high labor costs

Method used

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  • Optoelectronic package and fabrication method
  • Optoelectronic package and fabrication method
  • Optoelectronic package and fabrication method

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Embodiment Construction

[0013] According to an embodiment of the present invention, a method for making an optoelectronic package 1 ( Figure 10 ), 101( Figure 17 ), 201( Figure 23 ), 301( Figure 20 ) method comprising: (a) disposing an optical device 114, 214, 314, 414, 514 (representing at least one optical device) within a window 12, 112, 212, 312 of a substrate 10 with the active side 115 up and at Below the substrate top surface 11 ( figure 1 , 12, 18 and 21); (b) fill the window with optical polymer material 22, 122, 222, 322 ( figure 2 , 12, 18 and 22); (c) planarizing the surface of the optical polymer material and substrate; (d) patterning (pattern) waveguide material 34, 134, 234, 334 on the substrate and optical polymer material, Optical interconnect channel 27 (at least one) is formed, and mirror 38 (at least one) is formed to reflect light from the optics to the interconnect channel ( Figure 3-4 , 13-14, 18, 22); and (e) form a via (via) 44 (at least one) to expose the bonding...

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Abstract

An optoelectronic package is fabricated by a method which includes: positioning an optical device within a window of a substrate active-side up and below a top substrate surface; filling the window with an optical polymer material; planarizing surfaces of the optical polymer material and the substrate; patterning waveguide material over the optical polymer material and the substrate to form an optical interconnection path and to form a mirror to reflect light from the optical device to the interconnection path; and forming a via to expose a bond pad of the optical device.

Description

technical field [0001] The invention relates to an optoelectronic package and a manufacturing method. [0002] This application is related to commonly assigned US Patent Application Serial No. 10 / 064581, filed July 29, 2002, and entitled "Method and Apparatus for Fabricating a Waveguide and Fabricated Waveguide." This application is hereby incorporated by reference. Background technique [0003] Traditional optoelectronic modules include many discrete components such as laser diodes, optical fibers, lenses, couplers, electronic driver chips, and signal amplifiers. Each of the different components has different packaging requirements, and efficiently assembling these components within a single module has become a challenge. For example, in single-mode waveguide embodiments, the attachment of optical components typically involves precise sub-micron placement (alignment on the order of about 0.25 μm) and fast-curing adhesives. Traditional methods have included active compone...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G02B6/43G02B6/42G02B6/12G02B6/122G02B6/138
CPCG02B6/138G02B6/1221G02B6/122G02B6/12004G02B6/12002G02B6/42H01L2224/04105H01L2224/32225H01L2224/32245H01L2224/73267H01L2924/15153H01L2924/15192
Inventor 理查德·J·赛阿托马斯·B·戈齐卡克里斯托弗·J·卡普斯塔欧内斯特·W·鲍尔奇格伦·S·克莱登萨米塔·达斯格普塔伊拉迪奥·C·德尔加多
Owner GENERAL ELECTRIC CO
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