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Electronic device and method of manufacturing the same

A technology for electronic devices and manufacturing methods, applied in the directions of manufacturing tools, microstructure devices, and processing microstructure devices, etc., can solve the problems of connection reliability and easy disconnection of connecting parts, so as to improve reliability and increase strength. Effect

Inactive Publication Date: 2006-03-15
SEIKO EPSON CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, when external stress or bending force acts, disconnection is likely to occur at the connection portion between the connection terminal and the substrate wiring, and there is a problem in connection reliability.

Method used

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  • Electronic device and method of manufacturing the same
  • Electronic device and method of manufacturing the same
  • Electronic device and method of manufacturing the same

Examples

Experimental program
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Embodiment 2

[0108] Figure 4 , Figure 5 is a diagram illustrating an electronic device of Example 2, based on Figure 5 A side sectional view looking at line A-A. Figure 4 Symbol 2 in is an electronic device. Figure 5 It is a perspective plan view of a part (resin 35 described later) of the electronic device 2 for explaining the present invention.

[0109] Moreover, the second wiring 25 that connects the electronic device 2 of the present embodiment as the electronic device 1 of the embodiment covers the electrodes 34 formed on the first surface (upper surface) 32 of the IC chip 30, and the electrodes 34 formed on the first surface (upper surface) 32 of the IC chip 30 The outer peripheral portion forms an insulating portion described later. Furthermore, in order to prevent oxidation of the electrode 34, it is preferable to cover the entire surface of the electrode 34 with plating such as Ni. It is also desirable to form protrusions (bosses) made of metal materials such as Al, Ni—C...

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PUM

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Abstract

The present invention relates to an electronic device and a method of manufacturing the same. A base (10) is arranged on a substrate (5) forming a first wire (20); a second wire (25) is formed on the base (10); the second wire (25) is connected with the first wire (20) on the substrate (5). Moreover, at least one part of the end face of the base (10) becomes an upper surface opposite to the base (10), forming an inclined surface (10a) at an acute angle. In addition, other parts (30) are arranged on the base (10), and the other parts (30) are connected with the second wire (25). The present invention provides an electronic device and a manufacturing method thereof which prevent the connecting parts of the wires from breaking when the wires are formed on the base or connected with the base through jump, so as to improve connection reliability.

Description

technical field [0001] The present invention relates to an electronic device and a manufacturing method thereof. Background technique [0002] In recent years, using MEMS (Micro Electro Mechanical System) technology to manufacture ultra-small, ultra-high-performance electronic components (MEMS components) research and development prevail. Electronic parts using MEMS technology span many fields, but as one of them, an inkjet head constituting an inkjet printer and the like are known. However, in electronic parts (electronic devices) manufactured by MEMS technology and electronic parts manufactured by technologies other than MEMS, due to restrictions on the area of ​​the substrate constituting the electronic part and other reasons, it is sometimes impossible to form the electronic parts formed on the substrate. Substrate wiring and terminal portions of parts such as semiconductor chips mounted on the substrate are directly connected on the substrate surface. [0003] For exa...

Claims

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Application Information

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IPC IPC(8): H01L23/498H01L21/60B81B7/02B81C3/00
CPCH01L2224/82007H01L2224/24998H01L2224/76155H01L24/25H01L2224/05554H01L2224/25H01L2924/00012
Inventor 桥元伸晃
Owner SEIKO EPSON CORP