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Opposed target sputtering apparatus and method for mfg.organic electroluminescence display

A target sputtering and sputtering target technology, which is applied in sputtering coating, circuits, electrical components, etc., and can solve problems such as mass production restrictions

Inactive Publication Date: 2006-03-29
SAMSUNG SDI CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0014] However, the facing target sputtering device can only install a substrate and sputter to form a thin film, so it is limited in mass production

Method used

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  • Opposed target sputtering apparatus and method for mfg.organic electroluminescence display
  • Opposed target sputtering apparatus and method for mfg.organic electroluminescence display
  • Opposed target sputtering apparatus and method for mfg.organic electroluminescence display

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Embodiment Construction

[0034] Hereinafter, embodiments provided by the present invention will be described in detail with reference to the drawings.

[0035] Figure 2a A longitudinal sectional view of a facing-target sputtering device provided for describing an embodiment of the present invention, Figure 2b A plan view of a facing-target sputtering apparatus provided for describing an embodiment of the present invention, Figure 2c It is a schematic diagram of a facing-target sputtering device provided for describing an embodiment of the present invention.

[0036] Such as Figures 2a to 2c As shown, the facing target sputtering device 100 provided by the embodiment of the present invention includes a chamber part 200 forming the casing of the facing target sputtering device 100, a sputtering target part 300 and a power supply provided in the chamber The supply device 400 is formed.

[0037] The chamber unit 200 includes a chamber 210 forming a housing of the facing-target sputtering apparatus...

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PUM

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Abstract

To provide a sputtering apparatus that prevents a thin film from being damaged due to the collision of particles having high energy against a substrate, which are produced when the film is formed, by using discoidal facing targets, and that suits to mass production because of rotating a plurality of the substrates to be thin-film-formed around the discoidal facing target, and to provide a method for manufacturing an organic electroluminescent display device by using it. This sputtering apparatus comprises: a chamber section provided with a chamber which is a body, and a substrate-mounting part capable of mounting a plurality of the substrates thereon along an inner wall of the chamber; a pair of the facing sputtering targets which are placed so as to face with each other at a predetermined distance and form a restrictive space; and a magnetic-field-generating means which are placed on each back face of a pair of the targets and generate a magnetic field in the restrictive space.

Description

technical field [0001] The present invention relates to a sputtering device and a method for manufacturing an organic electroluminescent display device using the device, in particular to a target-oriented sputtering device and a method for manufacturing an organic electroluminescent display device using the device, thereby Film damage caused by particles having high energy colliding with a substrate during thin film formation is prevented by using a disk-shaped facing target, and formed by rotating a plurality of substrates around the disk-shaped facing target film, which is suitable for mass production. Background technique [0002] Generally, in an organic electroluminescent display device, an electron injection electrode (cathode) and a hole (hole) injection electrode (anode) respectively inject electrons (electrons) and holes (holes) into an emitting layer (emitting layer). A light-emitting display device that emits light when the injected elect...

Claims

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Application Information

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IPC IPC(8): C23C14/35C23C14/54
CPCC23C14/3407C23C14/35C23C14/50H10K71/00
Inventor 金汉基李奎成许明洙郑京勋郑锡宪
Owner SAMSUNG SDI CO LTD