Base board delivery device

Abstract

In the substrate transfer apparatus 41 which is equipped with the arm component 51 which has two or more adsorption pads 56, lays the processed substrate G on the adsorption pad 56, and performs carrying in appearance of the processed substrate G to a substrate processing part. The substrate transfer apparatus 41 has an oscillating means to vibrate the adsorption pad 56, an oscillating drive means 57 to drive the oscillating means, and a control means 58 to perform control of the oscillating drive means 57 of operation. When the processed substrate G is laid on the adsorption pad 56, the control means 58 drives the oscillating drive means 57, and the adsorption pad 56 is vibrated.

Description

technical field [0001] The present invention relates to a substrate transfer device that places a substrate to be processed on an arm member, and performs loading and unloading processing of the substrate to be processed to a substrate processing unit. Background technique [0002] For example, in LCD manufacturing technology, after forming a predetermined film on the LCD substrate as the substrate to be processed, a photosensitive resist solution is applied to form a resist film, and the resist film is exposed according to the circuit pattern. The processing, which is called development processing, uses so-called photolithography to form circuit patterns. In this photolithography technology, for the LCD substrate as the substrate to be processed, as the main process, it goes through cleaning treatment→dehydration baking→adhesion (hydrophobic) treatment→coating resist→pre-baking→exposure→development→ A series of processes such as post-baking form a predetermined circuit pat...

AI Technical Summary

Problems solved by technology

If the arm member with the above-mentioned adsorption spacer is used, although it can fully adapt to the small substrate to be processed that will not be bent due to its own weight, for a large substrate to be processed, the substrate is easy to handle due to its own weight. Warping or bending occurs, and there is a problem that all adsorption pads cannot simultaneously adsorb the substrate surface due to its influence

[0009] That is, when a warp or the like occurs on the substrate, the suction pad cannot properly incline along the warp, etc., so the substrate cannot be properly adsorbed.

As a result, the substrate is more tilted, causing looseness, which may damage the substrate

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