Base board delivery device

Abstract

The present invention provides a substrate transfer apparatus which places a substrate to be treated on arm members and then carries it in and out of a substrate treatment section and which can certainly hold the substrate with no rattling even if it is large, by surely sucking the substrate by suction pads formed on the arm members. The substrate transfer apparatus 41 includes the arm members 51, each having a plurality of suction pads 56, places the substrate G to be treated on the suction pads 56, and then carries the substrate G in and out of the substrate treatment section. The substrate transfer apparatus 41 comprises a vibrating means for vibrating the suction pads 56, a vibration driving means 57 for driving the vibrating means, and a controlling means 58 for controlling the operation of the vibration driving means 57. When placing the substrate G to be treated on the suction pads 56, the controlling means 58 operates the vibrating means by means of the vibration driving means 57 to vibrate the suction pads 56.

Description

technical field [0001] The present invention relates to a substrate transfer device that places a substrate to be processed on an arm member, and performs loading and unloading processing of the substrate to be processed to a substrate processing unit. Background technique [0002] For example, in LCD manufacturing technology, after forming a predetermined film on the LCD substrate as the substrate to be processed, a photosensitive resist solution is applied to form a resist film, and the resist film is exposed according to the circuit pattern. The processing, which is called development processing, uses so-called photolithography to form circuit patterns. In this photolithography technology, for the LCD substrate as the substrate to be processed, as the main process, it goes through cleaning treatment→dehydration baking→adhesion (hydrophobic) treatment→coating resist→pre-baking→exposure→development→ A series of processes such as post-baking form a predetermined circuit pat...

AI Technical Summary

Problems solved by technology

If the arm member with the above-mentioned adsorption spacer is used, although it can fully adapt to the small substrate to be processed that will not be bent due to its own weight, for a large substrate to be processed, the substrate is easy to handle due to its own weight. Warping or bending occurs, and there is a problem that all adsorption pads cannot simultaneously adsorb the substrate surface due to its influence

[0009] That is, when a warp or the like occurs on the substrate, the suction pad cannot properly incline along the warp, etc., so the substrate cannot be properly adsorbed.

As a result, the substrate is more tilted, causing looseness, which may damage the substrate

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