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High-frequency module and electronic device using the module

A technology of high-frequency modules and electronic components, which is applied in the field of high-frequency modules and can solve problems such as poor shielding performance

Inactive Publication Date: 2006-04-26
PANASONIC CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Conventional high-frequency modules using such a shield box 6 have a problem of poor shielding performance due to the hole 11 formed in the top plate 6a.

Method used

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  • High-frequency module and electronic device using the module
  • High-frequency module and electronic device using the module
  • High-frequency module and electronic device using the module

Examples

Experimental program
Comparison scheme
Effect test

Embodiment approach 1

[0033] Embodiment 1 of the present invention will be described below with reference to the drawings. figure 1 is a cross-sectional view of the high-frequency module in Embodiment 1 of the present invention, figure 2 It is a plan view of the circuit board in Embodiment 1. and image 3 is a side view of the shielding box in Embodiment 1, Figure 4 Its bottom view. figure 1 in, for with Figure 19 , Figure 20 The same parts are assigned the same reference numerals and their descriptions are simplified.

[0034] like figure 2 As shown, the circuit board 1 used in Embodiment 1 has a ground pattern 21 provided in an approximately central portion. This ground pattern 21 is connected to a ground terminal 22 provided on the end portion 1 c side of the circuit board 1 . Further, a through hole 10 is formed in a substantially central portion of the circuit board 1 , and is connected to a ground pattern 21 . Here, the via hole 10 refers to a conductive via hole in which a con...

Embodiment approach 2

[0062] Embodiment 2 will be described below with reference to the drawings. Figure 9 is a plan view of the shield box 101 in Embodiment 2, Figure 10 It is a schematic diagram of the mounting process of the high-frequency module using the high-frequency module 101 on the motherboard in the second embodiment. in addition, Figure 9 , Figure 10 in, for with Figure 1 to Figure 4 The same parts are assigned the same reference numerals and their descriptions are simplified.

[0063] In Embodiment 2, the oscillator 4 and the PLL circuit 5 are separated at the center, and the partition plate 36 is formed at a position passing through the center of the shield box 101 . That is, in this case, the opening portion 35 is at a position passing through the center of the top portion 32 .

[0064] Figure 10 Shown is a high-frequency module 102 in which a shield case 101 is attached to a circuit board 1 on which electronic components 2 and 3 (not shown) are preliminarily mounted. Th...

Embodiment approach 3

[0070] Embodiment 3 will be described below with reference to the drawings. Figure 11 It is a cross-sectional view of the high-frequency module 145 in the third embodiment. Figure 12 It is a plan view of the circuit board in Embodiment 3. Figure 13 , Figure 14 These are a side view and a bottom view of the shield box according to Embodiment 3, respectively. Additionally, in these figures, with Figure 1 to Figure 10 The same parts are assigned the same reference numerals and their descriptions are simplified.

[0071] first use Figure 12 The circuit board used in Embodiment 3 will be described. Figure 12 Shown in is a 4-layer circuit substrate 111 . The circuit board 111 has a ground pattern 112 at a substantially central portion. Furthermore, the ground pattern 112 is connected to the ground pattern 113 provided along the periphery of the circuit board 111 and also connected to the ground terminal 114 provided at the end of the circuit board 111 .

[0072] Next,...

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PUM

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Abstract

A high-frequency module with a shielding box installed, the partition (36) of the shielding box has a wall (37) bent from the top (32), opposite to the wall (37) and bent from the top (32) The wall (38) and the connecting portion (39) connecting the front end of the wall (38) and the front end of the wall (37). The shielding box also has cutouts that are respectively located at the intersection of the wall (37), the top (32), the side plate (33) and the intersection of the wall (38), the top (32), and the side plate (33) (43), and from the cutout (43) downwards the breaking part (44) that the side plate (33) is cut off, the boundary between the circuit group (4) and the circuit group (5) is located at the dividing plate (36 ) corresponding to the position, while the connection part (34) is connected to the grounding part of the circuit group (4) or the circuit group (5). According to the present invention, it is possible to prevent signals and the like in circuits formed on the circuit board from leaking to the outside, and the shielding performance is good.

Description

technical field [0001] The present invention relates to a high-frequency module to which a shield case is attached for use in a high-frequency device or the like. Background technique [0002] Hereinafter, a conventional high-frequency module described in, for example, Japanese Patent Application Laid-Open No. 11-331015 will be described with reference to the drawings. Figure 19 is a cross-sectional view of a conventional high-frequency module using a shielding box, Figure 20 It is the bottom view of the above-mentioned shielding box. [0003] In the conventional high-frequency module, electronic components 2 and 3 are mounted on the upper surface 1 a of the circuit board 1 . On the circuit board 1 , an oscillator 4 constituted by electronic components 2 and a PLL circuit 5 constituted by electronic components 3 form a high-frequency module. In addition, the oscillator 4 is an example of a first circuit group, and the PLL circuit 5 is an example o...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K9/00H05K5/03
CPCH01L2924/16153H05K9/0022
Inventor 小仓智英木村润一江崎则治冈本龟也
Owner PANASONIC CORP