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Methods and apparatus for high speed object handling

A technology of disposal system and processing station, applied in the field of high-speed object disposal, which can solve the problems of low throughput and high cost

Inactive Publication Date: 2006-04-26
VARIAN SEMICON EQUIP ASSOC INC
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  • Abstract
  • Description
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Problems solved by technology

[0007] All known prior art wafer handling systems have suffered from one or more drawbacks including but not limited to relatively low throughput and high cost

Method used

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  • Methods and apparatus for high speed object handling
  • Methods and apparatus for high speed object handling
  • Methods and apparatus for high speed object handling

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Embodiment Construction

[0028] A prior art wafer handling system of the type disclosed in the aforementioned US Patent No. 5,486,080 is shown in FIG. 1 . The vacuum chamber 10 contains a first robot 12 , a second robot 14 , a transfer station 16 and a processing station 18 . Vacuum locks 20 and 22 communicate with vacuum chamber 10 through isolation valves 24 and 26, respectively. Cassettes 30 and 32 each containing a plurality of semiconductor wafers are placed in corresponding vacuum locks 20 and 22 .

[0029] In operation, wafers are removed from cassette 30 by first robot 12 and placed on transfer station 16 . Transfer station 16 includes wafer support and position sensors that determine the displacement and rotation errors of the wafer relative to a reference value. Position sensing typically requires rotation of the wafer relative to the sensor. Rotation errors are corrected by proper rotation of the wafer support at transfer station 16 . The wafer is then transferred by the second robot 14...

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Abstract

Methods and apparatus for high speed workpiece handling are provided. A method for workpiece handling includes: utilizing a first robot to remove a workpiece from a first magazine; transferring the workpiece from the first robot directly to a second robot without transferring the workpiece to a transfer station; utilizing the A second robot places the workpiece on a workpiece holder at a processing station; and transfers the workpiece from the workpiece holder to the first cassette with the first robot after processing. The end effectors of the first and second robots may each have a plurality of vertical positions for efficient workpiece handling. The displacement and rotation errors of the workpiece can be sensed and corrected without using a transfer station. The method and apparatus are useful for handling semiconductor wafers.

Description

technical field [0001] The present invention relates to high speed object handling, and more particularly to methods and apparatus for moving workpieces, such as semiconductor wafers, in a vacuum chamber for high processing throughput. Background technique [0002] Processing of semiconductor wafers for the manufacture of microelectronic circuits involves processing tools for performing a large number of processing steps. The processing steps are typically performed in a vacuum chamber. The processing tool typically handles and processes one wafer at a time to optimize control and reproducibility. Such processing tools utilize automated wafer handling systems. [0003] Throughput of processing tools is an important factor in achieving low cost manufacturing. Overall throughput is a function of process time and efficiency of automated wafer handling. Wafer handling involves introducing wafers in cassettes or other wafer holders into a vacuum chamber, typically by a load l...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/00G06F7/00H01L21/677H01L21/68
CPCH01L21/67745H01L21/67748H01L21/67778H01L21/681Y10S414/137Y10S414/141Y10S414/136Y10S414/139H01L21/68
Inventor 格兰特·肯奇·拉森
Owner VARIAN SEMICON EQUIP ASSOC INC
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