Dual L seamless high power electronic amperite housing

A kind of electronic ballast and fit technology, applied in the direction of electric light source, electrical components, lighting devices, etc., can solve the problems of high-power radio frequency interference, unreasonable process, circuit instability, etc., to improve electromagnetic compatibility, heat dissipation effect The effect is obvious and easy to install and debug

Inactive Publication Date: 2006-05-03
SHANGHAI NAT ENG RES CENT FORNANOTECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

"Its disadvantage is that it is not only extremely difficult to install the high-power tubes at the bottom of the shell, but also the heat source is concentrated and it is not conducive to heat dissipation.
If debugging and maintenance cannot be carried out after installation, it will be very troublesome and unreasonable process
In addition, installing the high-power tubes of the PFC circuit and the high-power tubes of the half-bridge circuit together will cause serious high-power radio frequency interference between each other, making the circuit itself extremely unstable

Method used

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  • Dual L seamless high power electronic amperite housing
  • Dual L seamless high power electronic amperite housing

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Embodiment Construction

[0013] Such as figure 1 As shown, the present invention includes: a lower L-shaped shell 1, an upper L-shaped shell 2, a first side cover 3, a second side cover 4, two concave-convex joint points 5, and two lower L-shaped shells with the same shape and size. The L-shaped housing 1 and the upper L-shaped housing 2 form an L-shaped main housing through the relative fit of two concave-convex joint points 5. The two ends of the L-shaped main housing are square in section, and the first side cover 3 and the second side 4 is fixed on the two end sections of the L-shaped main shell by screws, and the two concavo-convex joint points 5 are concavo-convex shapes with the same nominal size.

[0014] For the two concave-convex meeting points 5, the positive tolerance is selected for the concave shape, and the negative tolerance is selected for the convex shape, so as to maintain a three-level interference fit during the fit.

[0015] The central dimensions of the two concavo-convex joint...

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Abstract

This invention relates to a shell of a double-conjugated L-shaped large power electronic ballast including: a lower L-shaped shell, an upper L-shaped shell, a first side cover, a second side cover, two convex / concave points, in which, the two L-shaped shells in a same shape and size form a master shell by conjugating the two points, the end surfaces of both sides of the master shell are square, the two side covers are fixed at the cross sections of both ends and the two conjugated points are in the shape of the nominal convex / concave .

Description

technical field [0001] The invention relates to a casing, in particular to a casing of a double-L fit high-power electronic ballast, which belongs to the technical field of electronic assembly. Background technique [0002] In the past, various types of high-power electronic ballast shells generally have the following problems: the circuit board can only be installed under the condition that everything is debugged. It cannot be debugged or inspected and repaired after loading. High-power tubes are generally fixed to the housing by screws to achieve heat dissipation, but it is very difficult to install. [0003] Found through literature search to prior art: Chinese Patent Publication No. 1376024, and the disclosure date is October 23rd, 2002, and the title of patent is: power electronic ballast sealed heat dissipation shell, and this patent self-statement is: " the large size disclosed by the present invention The power electronic ballast has a sealed heat dissipation shell...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05B41/02H05K7/20
Inventor 张伟韩杰
Owner SHANGHAI NAT ENG RES CENT FORNANOTECH
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