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Surface acoustic wave demultiplexer

A surface acoustic wave and filter technology, applied in the direction of electrical components, impedance networks, etc., can solve problems such as the difficulty of miniaturizing surface acoustic wave branch filters

Active Publication Date: 2006-05-31
MURATA MFG CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, it is difficult to miniaturize the surface acoustic wave branch filter due to the structure of this filter using welded wires.

Method used

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  • Surface acoustic wave demultiplexer
  • Surface acoustic wave demultiplexer
  • Surface acoustic wave demultiplexer

Examples

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Embodiment Construction

[0045] The present invention will become more apparent from the following description of specific embodiments of the present invention in conjunction with the accompanying drawings.

[0046] figure 1 (a) and 1(b) are an exploded perspective view and a front view, respectively, illustrating a surface acoustic wave branch filter according to a first embodiment of the present invention. figure 2 is a schematic diagram showing the structure of the surface acoustic wave branch filter circuit of this embodiment.

[0047] Such as figure 2 As shown, the surface acoustic wave branch filter 1 has an antenna connection terminal 2 connected to the antenna ANT. Both the transmitting side surface acoustic wave branch filter chip 3 of the first surface acoustic wave branch filter chip and the receiving side surface acoustic wave branch filter chip 4 of the second surface acoustic wave branch filter chip are connected to the antenna connection terminal 2 . The phase matching element 5 ...

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Abstract

A surface acoustic wave branch filter, wherein first and second surface acoustic wave branch filter chips are installed in a combined part by a flip-chip bonding method, so that the gap between the first and second surface acoustic wave branch filter chips is Isolation characteristics are improved and beneficial attenuation characteristics are achieved. The first surface acoustic wave branch filter chip has a lower center frequency, and the second surface acoustic wave branch filter chip (4) has a larger center frequency, and they are bonded to the chip mounting surface of the assembly part (8). A signal wiring pattern (24) is formed on the chip mounting surface. The bumps on the second surface acoustic wave branch filter chip (4) are bonded to the signal wiring pattern (24). Part of the signal wiring pattern (24) is closer to the ground wiring pattern (25) than to the bump.

Description

technical field [0001] The present invention relates to a surface acoustic wave branch filter used as a branch filter such as an antenna section connected to a wireless communication device. Specifically, it relates to a surface acoustic wave branch filter, in which there are first and second surface acoustic wave branch filter chips with different center frequencies in its structure, passing through bumps arranged on the surface acoustic wave branch filter chip Bonds to the wiring pattern provided on the assembly part. Background technique [0002] In recent years, in order to achieve further miniaturization, various branch filters using surface acoustic wave branch filters are being developed to make wireless communication equipment such as portable telephones more compact. [0003] In this type of surface acoustic wave branch filter, first and second surface acoustic wave branch filters having different center frequencies are installed in the form of a combined component...

Claims

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Application Information

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IPC IPC(8): H03H9/72H03H9/05H03H9/145H03H9/25
CPCH03H9/0576H03H9/1071H03H9/14538H03H9/6483H03H9/72H03H9/725
Inventor 谷口典生岸本恭德
Owner MURATA MFG CO LTD
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