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Method for producing bridge modules

A technology of bridges and chip modules, applied in the direction of recording carriers, instruments, and electrical solid devices used in machines, to achieve low material and production costs and cost savings

Inactive Publication Date: 2006-10-04
MUEHLBAUEHR AG
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

These methods all require special and in some cases complex chip designs, which limits their use to certain chip types and manufacturers

Method used

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  • Method for producing bridge modules
  • Method for producing bridge modules

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Embodiment Construction

[0061] figure 1 In a simplified manner, the procedure of the production method according to the invention is shown in a block diagram. In a first step 1, a conveyor belt made of plastic or paper is provided. In a second step 2, the conveyor belt is shaped, for example by means of thermoplastic forming, embossing or stamping. A three-dimensionally shaped conveyor belt is thus formed with recesses arranged one behind the other (step 3).

[0062] Step 4 consists of positioning the chip module in the recess, which has been filled with a predetermined amount of adhesive. Thus, each chip module is removed from the wafer and inserted into a recess (step 5).

[0063] In steps 6 and 7, the adhesive is solidified by using UV, electron beam and / or thermal irradiation, thereby fixing the chip module. It should ensure that the top edge of the chip module is in the same plane as the surface of the conveyor belt.

[0064] In steps 8 and 9, an electrically conductive silver paste is prin...

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Abstract

Bridge modules for smart labels, enable the positioning of chip modules (5) on carriers and the bridged connection of said chip modules to connection elements of antenna elements that are located on or in the carriers. A multiplicity of bridge modules is located sequentially on a carrier strip (1) that comprises numerous recesses (2) also sequentially positioned for receipt of the chip modules. Contact layers (7a, 7b) cover the connection elements of the chip module with the contact layers having a greater surface area than that of the connection elements.

Description

technical field [0001] According to the preamble of claim 1, the invention relates to a method for producing a module bridge for a smart label, said module bridge being used to position a chip module on a carrier and to electrically connect the connecting elements of the chip module to a device arranged on the carrier on the connection element of the antenna element on or in the carrier. Background technique [0002] The manufacture of smart tags involves placing an RFID (radio frequency identification chip), usually a silicon chip, on the antenna element and the connecting element of the antenna substrate carrying the antenna element. Such an antenna substrate may be, for example, a film, a label or a relatively inflexible plastic element. Since smart labels must be manufactured in large quantities per unit time, both the manufacturing speed and production cost in mass production are important factors for more efficient production of smart labels. [0003] For example, ma...

Claims

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Application Information

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IPC IPC(8): G06K19/077
CPCG06K19/07745G06K19/07752G06K19/07718H01L2924/0002G06K19/07749
Inventor 拉尔夫·戈德沃尔克·布罗德
Owner MUEHLBAUEHR AG