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Printing apparatus

A technology of printing device and supporting device, which is applied in the direction of printing, printing machine, rotary printing machine, etc., can solve the problem of stencil position deviation, etc., and achieve good support and restrain the effect of substrate inclination

Active Publication Date: 2010-07-07
YAMAHA MOTOR CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] In this type of printing device, when the squeegee slides on the stencil to spread the solder, the frictional resistance generated by the squeegee may shift the position of the stencil

Method used

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Examples

Experimental program
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Embodiment Construction

[0071] figure 1 is a side view of a screen printing device according to an embodiment of the present invention, figure 2 is the front view of the device, image 3 Fig. 4 is a top view of the device, and Fig. 4 is a perspective view of the main part of the device (printing station 10). As shown in these figures, a printing table 10 is provided on the base 2 of the screen printing apparatus, and on both sides of the printing table 10 , along the X-axis direction (conveyance direction), there are printed circuit boards for loading and unloading printed circuit boards W. The upstream side conveyor belt 11 and the downstream side conveyor belt 12 of the table 10 .

[0072] Moreover, the printing device includes: a clamp unit 3 for clamping the printed substrate W; a positioning unit 4 that engages with the upper surface of the substrate for positioning when clamping the substrate W; and a stencil holding unit arranged above the printing table 10 5 and the squeegee unit 6; as de...

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Abstract

The invention relates to a plating device which can keep large template adsorption area in plating, wherein said device comprises: a couple of clamp plates (31a, 31b) for clamping the base plate (W) at two sides; when the base plate is clamped, it can be set on the position devices (41a, 41b) of base plate; when the position devices (41a, 41b) are back to the side from base plate, the template (51) of base plate is held on the clamp plates (31a, 31b); via sliding one template, the welding material of template can be extended to coat the scrap plate (61) of base plate (W); when the template (51) is carried on the position device at back state, the upper surface of position devices (41a, 41b) are arranged with the adsorption device (45) of adsorption template (51).

Description

technical field [0001] The present invention relates to a printing device for printing solder such as cream solder on a substrate. Background technique [0002] Conventionally, a stencil (mask) for screen printing is superimposed on a substrate fixed on a printing table, and solder such as cream solder supplied to the stencil is spread by a squeegee and passed through an opening (pattern hole) formed on the stencil. ) A screen printing device for printing (applying) solder on a predetermined position of a substrate is well known. [0003] In such a printing device, when the squeegee slides on the stencil to spread the solder, the frictional resistance generated by the squeegee may shift the position of the stencil. [0004] For this reason, in the screen printing devices shown in Patent Document 1 (Japanese Patent Laid-Open No. Hei 5-185580) and Patent Document 2 (Japanese Patent Laid-Open No. Hei 10-284829), clamps for holding the substrate from both sides are used. There...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K3/34B41F15/08B41F15/26B41F15/36B41F15/40
Inventor 楠木寿幸秋吉洋
Owner YAMAHA MOTOR CO LTD
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