Component mounting method and apparatus

An installation method and component technology, applied in the direction of electrical components, electrical components, etc., can solve the problems of inaccessibility and high installation accuracy

Inactive Publication Date: 2006-11-08
PANASONIC CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0002] Although the component mounting process includes picking up the component with the suction nozzle of the component head, recognizing the picked up component with the camera, and performing mounting of the component on the board by driving the X-Y robot to move the component head in the X- and Y-directions, however, Due to the deformation of the component mounting device itself, no matter how much the component recognition accuracy is improved, high mounting accuracy cannot be achieved

Method used

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  • Component mounting method and apparatus
  • Component mounting method and apparatus
  • Component mounting method and apparatus

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no. 1 example

[0115] A first embodiment according to the present invention will be described in detail below with reference to the drawings.

[0116] Such as Figures 1 to 4 As shown in , the component mounting apparatus 100 capable of implementing the component mounting method according to the first embodiment includes a chassis 110 as a basic structural element, an X-Y robot 120, a board recognition camera 140 as an example of a board recognition device for recognizing a board recognition target , a component recognition camera 150 , a control unit 170 , a component feeding unit 180 , and a board conveying unit 190 .

[0117]The chassis 110 is mounted thereon the X-Y robot 120, the component recognition camera 150, the control unit 170, the component feeding unit 180, and the board delivery unit 190, and is constituted by a rectangular parallelepiped base portion 111 and a Y-axis robot leg portion 112 base. The base portion 111 and the Y-axis robot leg 112, that is, the chassis 110, are...

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Abstract

Reference marks arranged at specified intervals on a glass board are recognized, and from its recognition results, offset values for individual areas matching the board size are determined as numerical values for correction use, and further corresponding offset values for individual movement positions of a component placing head are reflected as numerical values for correction use in operation of placing position correction, mark recognition correction, or measurement of placing position offset values, respectively. Thus, high-accuracy placing is achieved. Moreover, correction of positional displacement of a component holding member due to an inclination of the component placing head is performed.

Description

technical field [0001] The present invention relates to a component mounting device and method for placing components on a board with high precision. Background technique [0002] Although the component mounting process includes picking up the component with the suction nozzle of the component head, recognizing the picked up component with the camera, and performing mounting of the component on the board by driving the X-Y robot to move the component head in the X- and Y-directions, however, Due to the deformation of the component mounting device itself, no matter how much the component recognition accuracy is improved, high mounting accuracy cannot be obtained. The deformation of the component mounting apparatus itself is caused by poor machining accuracy and poor assembly accuracy of the X-Y robot of the component mounting apparatus. [0003] The following is a more specific analysis of the inability to place high-precision components on the board during the placement pro...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K13/04H05K13/08
CPCH05K13/041H05K13/0812H05K13/089Y10T29/49133Y10T29/53087Y10T29/53178Y10T29/53183Y10T29/53187
Inventor 奥田修川濑健之吉富和之
Owner PANASONIC CORP
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