Component mounting method and apparatus

An installation method and component technology, applied in the direction of electrical components, electrical components, etc., can solve the problems of inaccessibility and high installation accuracy
CN1860837AInactive Publication Date: 2006-11-08PANASONIC CORP
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
PANASONIC CORP
Publication Date
2006-11-08
Estimated Expiration
Not applicable · inactive patent

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Abstract

Reference marks arranged at specified intervals on a glass board are recognized, and from its recognition results, offset values for individual areas matching the board size are determined as numerical values for correction use, and further corresponding offset values for individual movement positions of a component placing head are reflected as numerical values for correction use in operation of placing position correction, mark recognition correction, or measurement of placing position offset values, respectively. Thus, high-accuracy placing is achieved. Moreover, correction of positional displacement of a component holding member due to an inclination of the component placing head is performed.
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Description

technical field

[0001] The present invention relates to a component mounting device and method for placing components on a board with high precision. Background technique

[0002] Although the component mounting process includes picking up the component with the suction nozzle of the component head, recognizing the picked up component with the camera, and performing mounting of the component on the board by driving the X-Y robot to move the component head in the X- and Y-directions, however, Due to the deformation of the component mounting device itself, no matter how much the component recognition accuracy is improved, high mounting accuracy cannot be obtained. The deformation of the component mounting apparatus itself is caused by poor machining accuracy and poor assembly accuracy of the X-Y robot of the component mounting apparatus.

[0003] The following is a more specific analysis of the inability to place high-precision components on the board during the placement pro...

Claims

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