Rare earth medium slurry of rare earth thick film circuit based on metal plate and its preparation technology

A rare earth thick film, dielectric paste technology, used in circuits, conductive materials dispersed in non-conductive inorganic materials, resistance manufacturing, etc.
CN1909749AActive Publication Date: 2007-02-07GUANGDONGSHENG YUCHEN ELECTRONICS & TECH CO LTD

Patent Information

Authority / Receiving Office
CN · China
Current Assignee / Owner
GUANGDONGSHENG YUCHEN ELECTRONICS & TECH CO LTD
Publication Date
2007-02-07
Patent Text Reader

Abstract

The invention relates to a rare-earth meidum slurry of rare-earth circuit, based on the metal base board and a relative production, wherein it is characterized in that: said slurry is formed by solid material and organic solvent carrier, while their mass ratio is 70-90:30-10; the solid component is the glass in SiO2-Al2O3-CaO-B2O3-Bi2O3-La2O3 group, and the components of each oxidant have the mass percentages as: SiO2(30-65%), Al2O3(5-26%), CaO(18-38%), B2O3(2-16%), La2O3(0.3-15%), Co2O3(0.05-6%), TiO2(1-10%), ZrO2(1-10%). And the production comprises: (1), preparing rare-earth micro-crystal glass powder; (2), preparing organic solvent carrier; (3), mixing material in three-dimension and rolling with three rollers; (4), preparing medium slurry; (5), preparing the rare-earth slurry; (6), bottling. The invention is environment friend, better sinter property, better print property, and better humidity compatibility.
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Description

Technical field:

[0001] The present invention relates to rare earth dielectric paste for rare earth thick film circuits based on metal substrates, in particular to substrates based on ferritic stainless steel series, for example: national standard grades 1Cr15, 1Cr17, 00Cr12 and other foreign grades 429#, 430#, 410L# and other high-power rare earth Rare earth dielectric paste for thick film circuits and its preparation technology. Background technique:

[0002] In the sustainable development strategy established by our country, the two aspects involved are environmental protection, improving energy utilization rate and improving energy structure. In the field of electric heating, new heating elements require small volume, high power, small thermal inertia, large surface heat load, low power consumption, high thermal efficiency, fast thermal start, stable power, uniform temperature field, and process Good performance, self-temperature control of the body, safe and reliable o...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
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