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Hot-press

A technology of a hot press and a hot press device, applied in the field of hot presses, can solve the problems of inability to fully reach the temperature, waste of manpower, false welding, etc., and achieve the effects of shortening the production process time, preventing false welding, and reducing time.

Inactive Publication Date: 2007-02-21
ORIENT SEMICON ELECTRONICS
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  • Summary
  • Abstract
  • Description
  • Claims
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AI Technical Summary

Problems solved by technology

Wherein, during the thermocompression bonding process of the rigid circuit board 100 and the flexible circuit board 116, the large ground copper surface 114 and the large copper surface 128 will quickly absorb the heat energy provided by the thermocompression device (not shown in the figure), making it The temperature cannot fully melt the tin-lead on the solder pad 110, thus resulting in poor connection between the rigid circuit board 100 and the flexible circuit board 116, and false soldering, which greatly reduces the product qualification rate
In addition, both the rigid printed circuit board 100 and the flexible printed circuit board 116 have first and second fixed pads 112 and 122 designed to increase the strength against pulling. The welding work needs to be completed by the pressure device, but manual welding is required outside the line, resulting in a waste of manpower

Method used

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Embodiment Construction

[0014] first pass figure 2 and image 3 Briefly describe the basic structure and operating principle of the hot press of the present invention. see figure 2 , figure 2 It is a three-dimensional schematic view of the heat press 30 in the first preferred embodiment of the present invention. Such as figure 2 As shown, the heat press 30 of the present invention includes a movable upper module 32 and a lower module 36 . Wherein, the movable upper module 32 has a thermal pressing device 34, such as a thermal pressing head, and at least one high resistance material (not shown) is included in the thermal pressing device 34, and a high current module (not shown) ) provides a pulse current to the high-resistance material of the hot-pressing device 34, so that the hot-pressing device 34 can generate high temperature instantaneously. The lower module 36 has a temperature-adjustable heating device 37, which can set an appropriate heating temperature range according to the differe...

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Abstract

A hot pressing machine is composed of at least one lower die block with a temp-adjustable heater, and at least one movable upper die block with a hot pressing unit.

Description

technical field [0001] The invention relates to a hot press, in particular to a hot press whose lower module includes a heating device capable of preheating to prevent false welding and shorten the manufacturing process time. Background technique [0002] In recent years, all kinds of electronic products are required to be light, thin, short, and small, so the use space of the products is greatly limited. For example, LCD monitors, notebook computers, mobile phones, etc., so within the limited space must be The flexible circuit board plays an extremely important role in this manufacturing process environment so that the connecting components between the circuit boards can be bent. In contrast, the quality of the thermocompression bonding process of rigid circuit boards and flexible circuit boards has attracted much attention. Although this production process and equipment have been developed for several years, there are still some bottlenecks that cannot be broken. Please r...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B29C65/02
Inventor 李升学陈宗汉
Owner ORIENT SEMICON ELECTRONICS
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