Photoresist composition for forming light-proof pattern of plasma display device
A plasma display and photosensitive resin technology, applied in the field of photosensitive resin compositions, can solve the problems of difficulty in obtaining good patterns, residues on patterned substrates, increase in light-shielding substances, etc., and achieve excellent light-shielding properties, excellent display contrast, and development. Tolerant effect
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Embodiment 1
[0108] Using three rollers, 100 parts by mass of n-lauryl methacrylate / n-butyl methacrylate / methacrylic acid=20 / 60 / 20 (mass%) copolymer (Mw =150,000); and 10 parts by mass of ethanone as (C) photopolymerization initiator, 1-[9-ethyl-6-(2-methylbenzoyl)-9H-carbazole-3-substituted base]-, 1-(o-acetyl oxime) (CGI242, manufactured by Ciba Chemicals); and 20 parts by mass of pentaerythritol tetraacrylate as (D) photopolymerizable compound and 20 parts by mass of EO-modified trimethylol propane triacrylate (M-350 manufactured by Toagosei Co., Ltd.); and 150 parts by mass of Ni powder (average particle diameter 0.02 μm) as a conductive (A) light-shielding material; 50 parts by mass of Ni powder as a conductive material Ag powder (average particle diameter: 0.05 μm) was kneaded on a three-roll mill to prepare a photosensitive resin composition. The photosensitive resin composition was uniformly coated on a PET film (thickness of 38 μm) and dried in a hot air convection dryer at 70° C...
Embodiment 2
[0111] First, in addition to using 1,2-octanedione, 1-[4-(phenylthio)phenyl]-, 2-(o-benzoyl oxime) (CGI124, manufactured by Ciba Chemicals) 10 parts by mass as ( C) Except for the photopolymerization initiator, the photosensitive resin composition was prepared in the same manner as in Example 1 to obtain a photosensitive dry film.
[0112] Next, on the substrate obtained by washing and drying the glass plate (PD200) manufactured by Asahi Glass Co., Ltd., while removing the protective film, the temperature of the drum was 105° C., and the pressure of the drum was 2.9×10 -3 The photosensitive dry film was laminated under conditions of Pa and a drum speed of 1 m / min. Then, using a 3.5kw ultra-high pressure mercury lamp (manufactured by Hakuto Corporation) at 300mJ / cm 2 After exposing under conditions, spray development was performed for 45 seconds in a 0.3% by mass aqueous sodium bicarbonate solution to form a pattern. After the pattern is formed, the resin is burned to ashes b...
Embodiment 3
[0114] First, in addition to the photopolymerization initiator of Example 1, 5 parts by mass of imidazole group, namely 2-(o-chlorobenzene)-4,5-bisbenzimidazole dimer (B- CIM) Except for the (C) photopolymerization initiator, the photosensitive resin composition was prepared in the same manner as in Example 1, and a photosensitive dry film was obtained.
[0115] Next, on the substrate obtained by washing and drying the glass plate (PD200) manufactured by Asahi Glass Co., Ltd., while removing the protective film, the temperature of the drum was 105° C., and the pressure of the drum was 2.9×10 -3 The photosensitive dry film was laminated under conditions of Pa and a drum speed of 1 m / min. Then, using a 3.5kw ultra-high pressure mercury lamp (manufactured by Hakuto Corporation) at 150mJ / cm 2 After exposing under conditions, spray development was performed for 45 seconds in a 0.3% by mass aqueous sodium bicarbonate solution to form a pattern. After the pattern is formed, the res...
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