Throwing mixing homogenizing device

Abstract

A kind of whipping type mixture equality device includes one pivotal element, one whipping case element that is installed on the pivotal element and one driving element which is connected with the whipping case element. This whipping case element can use the pivotal element as the fulcrum and is pivotly installed to this pivotal element's side. This driving element is connected with the whipping case element's one side, and it can drive the whipping case element to use the pivotal element as the fulcrum, it will have a to-and-fro swing between the aligning position and the inclining position opposite to the pivotal element. Through the whipping case element's design, it can let the lapping plasm in the container which is handstand placed in the whipping case element to be impacted to the deposit of high viscosity lapping atom.

Description

technical field [0001] The invention relates to a uniform mixing device, in particular to a shaking type uniform mixing device. Background technique [0002] In the semiconductor or liquid crystal display manufacturing process, in order to make the surface of the wafer and the glass substrate of the liquid crystal display relatively smooth, the surface of the wafer and the glass substrate must be polished, and the polishing method is mostly chemical machine polishing (CMP). Taking the wafer as an example, the wafer is polished by uniformly distributing a slurry containing appropriate abrasive particles between a polishing pad and the wafer, and the uniformity of the distribution of the abrasive particles directly affects the flatness of the wafer surface. However, when the grinding slurry is not in use, the grinding particles in the grinding slurry will be deposited at the bottom of the container due to different densities, resulting in uneven distribution of the grinding pa...

AI Technical Summary

Problems solved by technology

[0004] But the shaking produced by this kind of shaking device will only cause the grinding slurry in the container 10 to generate turbulence, and the turbulence channel of the grinding slurry can only be used to break up some low-viscosity grinding particles (not shown). If it is used to shake high-viscosity abrasive particles such as the abrasive slurry used on the glass substrate of the liquid crystal display, it will be quite time-consuming, and it is difficult to disperse and evenly gather the high-viscosity abrasive particles distributed

Trace it to its cause, be that this kind of turbulent flow lacks the power that is deposited on the deposition area of ​​container 10 bottom directly impacts, and the centrifugal force that abrasive particles are taken away from the deposition area

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