Wet process device for etching wafer, and wet process etching method
Patent Information
- Authority / Receiving Office
- CN Β· China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- MACRONIX INT CO LTD
- Publication Date
- 2010-09-29
- Estimated Expiration
- Not applicable Β· inactive patent
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Abstract
Description
technical field
[0001] The invention relates to a wafer wet etching device and a wet etching method thereof, in particular to a wafer wet etching device and a wet etching method for rotating a wafer in etching liquid. Background technique
[0002] Electronic products are changing with each passing day. Along with the increasing demand for semiconductor chips, the rapid development of semiconductor technology has been driven. In order to reduce the volume occupied by the chip, the line width in the chip is continuously reduced. Therefore, the semiconductor process capability is severely tested, and the control of process accuracy and process variation is more important. Especially taking the wet etching process in the semiconductor process as an example, the variation of etching depth will greatly affect the yield rate of chip products.
[0003] A conventional wafer wet etching method is to immerse a wafer in a wet etching solution, and the wet etching solution can perform ...