Read-in and read device of millimicro data using cantilever structure and its manufacturing method

Abstract

A mill-macro data read and write equipment using cantilever structure, includes the cantilever formed by the deposition material deposited on the sacrificed substrate through composition of a picture, and the probe formed at the front part of a cantilever surface and at the same time with the formation of the cantilever. When the deposition material is deposited on the sacrificed substrate, it fills the probe groove picture formed on the sacrificed substrate with the deposition material, and forms the heater with polycrystalline silicon at the cantilever for heating probe, and provides the data sensor unit formed in the cantilever and senses the data written by the media, and connected to the data sensor unit and forms signal connecting pad to electrically connect the external signal lineat the cantilever, and connects to the signal transmission circuit unit of the signal connecting pad, to control writing and reading data at the media and from the media, and allows the cantilever tobe supported in the signal transmission circuit unit and provides the bonding unit between the signal connecting pad and the signal transmission circuit unit.

Description

technical field [0001] The present invention relates to a nano data writing and reading device using a cantilever structure and a manufacturing method thereof, and more particularly to a nano data writing / reading device using a cantilever structure and a device configured to improve the durability and performance of the cantilever structure And its manufacturing method significantly reduces the manufacturing process. Background technique [0002] In general, an atomic force microscope is a device for measuring the topography of a surface using a cantilever structure, and a fine cantilever probe is formed at a front end portion on one side of the cantilever in the atomic force microscope. By using cantilever probes, the surface topography and electrical or magnetic properties of a sample can be identified with nanoscale resolution. The great advantage of this AFM is that its resolution is high enough to directly measure the atomic structure by using probes of a few nanometer...

AI Technical Summary

Problems solved by technology

This bonding process greatly affects the overall yield of the product

That is, since such a wafer-level bonding process should be performed twice in the conventional method, the entire process becomes complicated, the yield of the final product is reduced and the cost is increased

[0025] If an SOI wafer with epitaxial silicon is used, the variation in cantilever thickness can be reduced, but still leaves the problem of greatly increased cost and wear of the probe

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