Method for discriminating welding disc and black disc failure state

A failure state and pad technology, applied in instruments, measuring devices, scientific instruments, etc., can solve the problems of high misjudgment and missed judgment of black disk failure phenomena, high misjudgment and missed judgment of solder pads or circuit boards, and achieve Reduce the occurrence of risks, quickly and accurately analyze and judge, and reduce the effect of missed judgments

Inactive Publication Date: 2007-06-20
HUAWEI TECH CO LTD
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  • Abstract
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Problems solved by technology

[0012] In practical application, the above scheme has the following problems: the probability of misjudgment and missed judgment on whether there is a black disk failure phenomenon on the solder pad or the circuit board light board is high
[0013] The main reason for this situation is that in the actual situation, there is a phenomenon of black disk failure but no "crack" phenomenon is found on the surface of the ni...

Method used

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  • Method for discriminating welding disc and black disc failure state
  • Method for discriminating welding disc and black disc failure state
  • Method for discriminating welding disc and black disc failure state

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Embodiment Construction

[0056] In order to make the object, technical solution and advantages of the present invention clearer, the present invention will be further described in detail below in conjunction with the accompanying drawings.

[0057] In the present invention, multiple detections are carried out on pads or circuit board light boards, and the failure of black pads is judged according to the detection results. Among them, the basis for judging failure phenomena that do not belong to black pads is added, especially with reference to the phosphorus content of pads. The failure of the black disk is judged. It is suitable for the analysis and determination of the failure of the black plate in the electronic assembly process, especially for the analysis and determination of whether the failure of the black plate is caused by the failure of the solder joint when the chemical nickel-gold pad is used in the electronic manufacturing process. .

[0058] Specifically, the detection of failures of pa...

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Abstract

A method for judging failure state of welding pad utilizes multiple integrated conditions to definitely judge out failure state of welding pad on circuit board welded with electric elements.

Description

technical field [0001] The invention relates to an electronic assembly process, in particular to a method for judging failure states of pads and black pads. Background technique [0002] With the development of electronic industry technology, in order to meet the requirements of high integration, the volume and pin spacing of components have become smaller and smaller, and the flatness of pads has long been an important factor affecting manufacturing quality. The chemical nickel-gold (Ni / Au) surface treatment process has the characteristics of flat pads and good solderability, which adapts to the high-density requirements of the electronics industry and is more and more widely used in the industry. The industry began to use electroless nickel-gold plating for surface treatment of circuit boards about ten years ago, but now electroless nickel-gold has become the main surface treatment method in high-seal packaging and assembly. [0003] Electroless Nickel / Immersion Gold ("EN...

Claims

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Application Information

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IPC IPC(8): G01N33/00G01R31/00
Inventor 刘桑周欣金俊文苑旺陈利民
Owner HUAWEI TECH CO LTD
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