Transferring and bonding device for brittle member

Abstract

A transferring and bonding device for a brittle member capable of peeling off a hard member from the brittle member without adding a stress more than required to the brittle member and effectively preventing the brittle member from being damaged by erroneous peeling. When the hard member is peeled off from a stuck structure formed by sticking the brittle member on the upper surface of the hard member through a double coated adhesive sheet to transfer and bond the brittle member onto the adhesive sheet, the adhesive tape is stuck on the brittle member side of the stuck structure to form it integrally with a frame, the hard member side is fixedly positioned on a table (8), and the frame (6) is raised, about a rotating shaft (13), diagonally upward relative to the surface of the table with a specified torque by a torque control motor (12). The hard member is peeled off from the brittle member with a force for raising the frame, i.e., with the specified torque. When the hard member is peeled off, the peeling action is confirmed by a peeling confirmation means (37) formed of two reflection sensors (38-1, 38-2).

Description

technical field [0001] The present invention relates to processing a brittle part such as a semiconductor wafer attached to a hard part such as glass to an extremely thin thickness, peeling the hard part from the brittle part, and transferring the brittle part to a dicing adhesive sheet ( Die cutting seat) is a transfer device for brittle parts used when sticking to a sheet. Background technique [0002] Conventionally, a structure described in Patent Document 1 is known as a transfer device for such a brittle member. The transfer device of this document, as shown in Figure 11, on the peeling object 1 (that is, the pasting structure 5 made of the hard part 2 and the brittle part 4 pasted by the double-sided adhesive sheet 3 on it) ) on the brittle part 4 side, the object to be peeled off and the frame are integrated with the frame by means of an adhesive sheet such as a cutting adhesive sheet 7, and after the hard part 2 is peeled off, the brittle part 4 is transferred to t...

AI Technical Summary

Problems solved by technology

[0004] However, when using the above-mentioned conventional transfer device, since the structure in which the frame 6 is raised by a simple cam mechanism is adopted, the force for raising the frame 6 is unstable, and unnecessary stress is sometimes added to the brittle member 4. , resulting in the brittle part 4 not being able to be peeled off smoothly

[0005] In addition, according to the transfer device in the past, it is generally unknown whether the normal peeling action of the hard part 2 has started, and regardless of whether a peeling defect has occurred, the frame 6 will be lifted, and unnecessary force will be applied on the brittle part 4, thereby Breakage of brittle parts 4 due to peeling defects

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