Sensor package structure

Abstract

A sensor package structure includes a substrate, an electronic chip fixed on the substrate by flip-chip bonding, a sealant disposed on the substrate and embedding the electronic chip therein, a sensor chip with a size larger than that of the electronic chip, a light-permeable sheet, a plurality of metal wires electrically connected to the substrate and the sensor chip, and a package body. A bottom surface of the sensor chip is disposed on the sealant to be spaced apart from the electronic chip. A lateral surface of the sensor chip is horizontally spaced apart from that of the sealant by a distance less than or equal to 3 mm. The package body is disposed on the substrate and covers the metal wires as well as the lateral sides of the sealant and the sensor chip. The light-permeable sheet is fixed above the sensor chip through the package body.

Description

CROSS-REFERENCE TO RELATED PATENT APPLICATION[0001]This application claims the benefit of priority to Taiwan Patent Application No. 107117000, filed on May 18, 2018. The entire content of the above identified application is incorporated herein by reference.[0002]Some references, which may include patents, patent applications and various publications, may be cited and discussed in the description of this disclosure. The citation and / or discussion of such references is provided merely to clarify the description of the present disclosure and is not an admission that any such reference is “prior art” to the disclosure described herein. All references cited and discussed in this specification are incorporated herein by reference in their entireties and to the same extent as if each reference was individually incorporated by reference.FIELD OF THE DISCLOSURE[0003]The present disclosure relates to a package structure, and more particularly to a sensor package structure.BACKGROUND OF THE DI...

AI Technical Summary

Benefits of technology

The present patent provides a sensor package structure that improves conventional sensor package structures by placing the electronic chip in the sealant or adhesive layer. This placement helps to prevent damage to the chip and avoids the issue of air bubbles during the wire bonding process. This results in a more robust and effective sensor package structure.

Problems solved by technology

However, during the wire-bonding process implemented for the conventional sensor package structure, the periphery portion of the larger chip is suspended over the substrate, and hence a force exerted on the larger chip by the wire-bonding often induces defects in the package structure.

Moreover, since there is a gap easily formed between the smaller chip and the suspended periphery portion of the larger chip, it is difficult to entirely fill the gap with a packaging compound, which in turn may cause air bubbles within the gap in the conventional sensor package structure.

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