Semiconductor integrated circuit and printed wiring substrate provided with the same

Abstract

When a semiconductor integrated circuit having a plurality of electrode pads disposed in an array-like form on the bottom surface thereof is mounted on a printed wiring substrate, a plurality of ground electrode pads and a plurality of power supply electrode pads are concentratedly arranged on the central portion of the semiconductor integrated circuit mounted on the printed wiring substrate so as to constitute groups so as to be opposed to each other, and a decoupling capacitor is mounted on the opposite surface of the printed wiring substrate through a through-hole, whereby the creation of radiation noise is suppressed and the higher density of the printed wiring substrate is achieved.

Description

BACKGROUND OF THE INVENTION[0001] 1. Field of the Invention[0002] This invention relates to a semiconductor integrated circuit having a plurality of electrode pads disposed in an array-like form on the bottom surface thereof, and a printed wiring substrate having the semiconductor integrated circuit mounted thereon.[0003] 2. Related Background Art[0004] In recent years, the circuit scale of a semiconductor integrated circuit has grown larger and larger. As the circuit scale of the semiconductor integrated circuit has grown larger, the number of pins necessary for the connection of the integrated circuit and an external circuit has been increased and therefore, an IC package having a plurality of electrode pads disposed in an array-like form on the bottom surface thereof has been developed. Since it is a semiconductor integrated circuit, the electrode pads disposed in an array-like form on the bottom surface thereof include a power supply electrode pad for supplying a power source to...

AI Technical Summary

Benefits of technology

[0007] It is an object of the present invention to solve the above-noted problem and to provide a semiconductor integrated circuit having the arrangement of array-like electrode pads which can effectively dispose a decoupling capacitor when a semiconductor integrated circuit having a plurality of electrode pads disposed in an array-like form on the bottom surface thereof is mounted on a printed wiring substrate.

Problems solved by technology

Therefore, when as represented by recent CPU's and microprocessors, the higher speed of the operating frequency of the semiconductor integrated circuit is remarkably progressing, there arises the problem that the radiation noise of electromagnetic waves from the printed wiring substrates having mounted thereon the semiconductor integrated circuit having the array-like electrode pads or an electronic apparatus carrying them thereon is increased and the standard for the unnecessary radiation noise regulated in various countries cannot be met.

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