Lead-free solder alloys

Abstract

A lead-free solder alloy which has a relatively low melting temperature and which is suitable for soldering electronic devices consists essentially of from 5 to 9 mass % of Zn, from 2 to 15 mass % of Bi, optionally from 0.001 to 1 mass % of P or from 0.001 to 0.1 mass % of Ge, and a balance of Sn. The solder alloy has a liquidus temperature of at most 220° C.

Description

[0001] 1. Field of the Invention

[0002] The present invention relates to solder alloys which are completely free from lead and are suitable for use in soldering of electronic devices without producing thermal damage.

[0003] 2. Description of the Related Art

[0004] Sn--Pb alloys have long been used for soldering in the electronics industry, and they are still the most popular alloys for soldering electronic devices to printed circuit boards or other substrates.

[0005] When electronic appliances such as televisions, radios, audio or video recorders, computers, pocket telephones, and copying or printing machines are to be discarded, they are typically disposed of in landfills, since they commonly include large amounts of synthetic resins (used for housings and printed circuit boards) and metals (used for frames and connecting wires) which are not suitable for incineration.

[0006] In recent years, acid rain (the phenomenon in which rain becomes highly acidic due to discharge of sulfur oxide ...