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Method for making a microstructure by surface micromachining

a microstructure and surface micromachining technology, applied in the manufacture of microstructure devices, microstructure technology, microstructure devices, etc., can solve the problems of obvious detrimental effect of microstructure on optical performance capabilities, and achieve the effect of enhancing the distribution of etchants and enhancing the release of simple, single structural layers

Inactive Publication Date: 2005-03-17
MEMX
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

"The present invention is a method for making microstructures by surface micromachining that includes forming a sacrificial material over a substrate and then removing it to release the microstructure from the substrate. The method includes depositing a first structural layer over the sacrificial material and then removing the sacrificial material through the hollow etch release channels or conduits that are formed within the sacrificial material. The etch release channels or conduits are laterally extending and can be non-intersecting or parallel to each other. The method also includes the use of multiple sacrificial layers that are sequentially deposited over each other. The use of the method results in a smooth microstructure surface with no vertical etch release apertures, making it suitable for optical applications."

Problems solved by technology

The presence of these small holes on the upper surface of the mirror microstructure has an obvious detrimental effect on its optical performance capabilities.

Method used

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  • Method for making a microstructure by surface micromachining
  • Method for making a microstructure by surface micromachining
  • Method for making a microstructure by surface micromachining

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Embodiment Construction

[0068] The present invention will now be described in relation to the accompanying drawings which at least assist in illustrating its various pertinent features. Surface micromachined microstructures and methods of making the same are the general focus of the present invention. Various surface micromachined microstructures and surface micromachining techniques are disclosed in U.S. Pat. Nos. 5,783,340, issued Jul. 21, 1998, and entitled “METHOD FOR PHOTOLITHOGRAPHIC DEFINITION OF RECESSED FEATURES ON A SEMICONDUCTOR WAFER UTILIZING AUTO-FOCUSING ALIGNMENT”; U.S. Pat. No. 5,798,283, issued Aug. 25, 1998, and entitled “METHOD FOR INTEGRATING MICROELECTROMECHANICAL DEVICES WITH ELECTRONIC CIRCUITRY; U.S. Pat. No. 5,804,084, issued Sep. 8, 1998, and entitled “USE OF CHEMICAL MECHANICAL POLISHING IN MICROMACHINING”; U.S. Pat. No. 5,867,302, issued Feb. 2, 1999, and entitled “BISTABLE MICROELECTROMECHANICAL ACTUATOR”; and U.S. Pat. No. 6,082,208, issued Jul. 4, 2000, and entitled “METHOD ...

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Abstract

Various methods for forming surface micromachined microstructures are disclosed. One aspect relates to executing surface micromachining operation to structurally reinforce at least one structural layer in a microstructure. Another aspect relates to executing the surface micromachining operation to form a plurality of at least generally laterally extending etch release channels within a sacrificial material to facilitate the release of the corresponding microstructure.

Description

FIELD OF THE INVENTION [0001] The present invention generally relates to making a microstructure by surface micromachining. One aspect relates to making a structurally reinforced microstructure to provide a flatter profile on one or more of its structural layers. Another aspect relates to providing a plurality of at least generally laterally extending etch release channels to facilitate the release of the microstructure from the substrate. BACKGROUND OF THE INVENTION [0002] There are a number of microfabrication technologies that have been utilized for making microstructures (e.g., micromechanical devices, microelectromechanical devices) by what may be characterized as micromachining, including LIGA (Lithographie, Galvonoformung, Abformung), SLIGA (sacrificial LIGA), bulk micromachining, surface micromachining, micro electrodischarge machining (EDM), laser micromachining, 3-D stereolithography, and other techniques. Bulk micromachining has been utilized for making relatively simple ...

Claims

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Application Information

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Patent Type & Authority Applications(United States)
IPC IPC(8): H01L21/00H01L21/302H01L21/304H01L21/461
CPCB81C1/00547H01L21/302
Inventor SNIEGOWSKI, JEFFRY J.RODGERS, M. STEVEN
Owner MEMX
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