Method for making a microstructure by surface micromachining
a microstructure and surface micromachining technology, applied in the manufacture of microstructure devices, microstructure technology, microstructure devices, etc., can solve the problems of obvious detrimental effect of microstructure on optical performance capabilities, and achieve the effect of enhancing the distribution of etchants and enhancing the release of simple, single structural layers
Patent Information
- Authority / Receiving Office
- US · United States
- Patent Type
- Applications(United States)
- Current Assignee / Owner
- Publication Date
- 2005-03-17
- Estimated Expiration
- Not applicable · inactive patent
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Abstract
Description
FIELD OF THE INVENTION
[0001] The present invention generally relates to making a microstructure by surface micromachining. One aspect relates to making a structurally reinforced microstructure to provide a flatter profile on one or more of its structural layers. Another aspect relates to providing a plurality of at least generally laterally extending etch release channels to facilitate the release of the microstructure from the substrate. BACKGROUND OF THE INVENTION
[0002] There are a number of microfabrication technologies that have been utilized for making microstructures (e.g., micromechanical devices, microelectromechanical devices) by what may be characterized as micromachining, including LIGA (Lithographie, Galvonoformung, Abformung), SLIGA (sacrificial LIGA), bulk micromachining, surface micromachining, micro electrodischarge machining (EDM), laser micromachining, 3-D stereolithography, and other techniques. Bulk micromachining has been utilized for making relatively simple ...
Examples
Embodiment Construction
[0068] The present invention will now be described in relation to the accompanying drawings which at least assist in illustrating its various pertinent features. Surface micromachined microstructures and methods of making the same are the general focus of the present invention. Various surface micromachined microstructures and surface micromachining techniques are disclosed in U.S. Pat. Nos. 5,783,340, issued Jul. 21, 1998, and entitled “METHOD FOR PHOTOLITHOGRAPHIC DEFINITION OF RECESSED FEATURES ON A SEMICONDUCTOR WAFER UTILIZING AUTO-FOCUSING ALIGNMENT”; U.S. Pat. No. 5,798,283, issued Aug. 25, 1998, and entitled “METHOD FOR INTEGRATING MICROELECTROMECHANICAL DEVICES WITH ELECTRONIC CIRCUITRY; U.S. Pat. No. 5,804,084, issued Sep. 8, 1998, and entitled “USE OF CHEMICAL MECHANICAL POLISHING IN MICROMACHINING”; U.S. Pat. No. 5,867,302, issued Feb. 2, 1999, and entitled “BISTABLE MICROELECTROMECHANICAL ACTUATOR”; and U.S. Pat. No. 6,082,208, issued Jul. 4, 2000, and entitled “METHOD ...