Laser ablation nozzle assembly

Abstract

A laser ablation system includes a first embodiment of a nozzle assembly where a laser beam is emitted through the nozzle assembly to remove materials on a target. The nozzle assembly includes a nozzle having a top end, and a window placed on the top end of the nozzle. The window includes one or more apertures and the laser beam is emitted through one of those apertures. Another laser ablation system includes a second embodiment of a nozzle assembly where a laser beam is emitted through the nozzle assembly to remove materials on a target. The nozzle assembly includes a nozzle having one or more channels at a top end of the nozzle. The nozzle assembly also includes a window that is placed on the one or more channels. A gas flows through the one or more channels and that gas flow reduces debris deposition on the window. Yet another laser ablation system includes a third embodiment of a nozzle assembly that includes a nozzle that has a central channel aligned longitudinally through which said laser beam travels from a top end of said nozzle to a bottom end of said nozzle. In this embodiment, the central channel of the nozzle is threaded.

Description

BACKGROUND OF THE INVENTION [0001] 1. Field of the Invention [0002] This invention relates generally to a laser ablation system and in particular to a laser ablation nozzle assembly. [0003] 2. Description of the Related Art [0004] Laser ablation and in particular ultraviolet (“UV”) laser ablation is widely used, for example, to remove materials from substrates. Such materials may be inorganic or organic (e.g., photo-resists and polymers) and often these to-be removed materials are in thin-film form coated on a substrate. For example, materials are removed using laser ablation to produce a via hole so that there is electrical contact between a top conductive layer and a bottom conductive layer through the via hole. In another example, materials are removed from areas of a thin-film electronic device using laser ablation so that those areas can be used to encapsulate the electronic device. In this case, an inorganic substrate (e.g., a glass substrate) is coated with organic layers (e....

AI Technical Summary

Benefits of technology

[0010] An embodiment of a nozzle assembly within a laser ablation system is described that, for example, reduces debris deposition on a window. The embodiment of the nozzle assembly includes a nozzle that has a top end and the window is located on the top end of the nozzle. The window has at least one aperture and a laser beam is emitted through a particular one of the at least one aperture.

[0011] An embodiment of a method is described that, for example, reduces debris deposition at one or more points on a window of a laser ablation system. The embodiment of this method includes generating a laser beam, and emitting the laser beam through an aperture at one of the points on the window.

[0012] Another embodiment of a nozzle assembly within a laser ablation system is described that, for example, reduces debris deposition on the window. This embodiment of the nozzle assembly includes a nozzle having at least one channel at a top end of the nozzle, a window located on the at least one channel, and a gas that flows through the at least one channel. The gas flow through the at least one channel reduces debris deposition on the window.

[0013] Another embodiment of a method is described that, for example, reduces debris deposition on a window of a laser ablation system. This embodiment of the method includes moving a gas through at least one channel that contacts the window to reduce the accumulation of debris on the window.

[0014] Yet another embodiment of a nozzle assembly within a laser ablation system is described that, for example, reduces the debris being re-deposited onto a target. This embodiment of the nozzle assembly includes a nozzle that has a central channel aligned longitudinally and through which a laser beam travels from a top end of the nozzle to a bottom end of the nozzle. The nozzle assembly also includes a window located on the top end of the nozzle. In this embodiment, the central channel is threaded.

Problems solved by technology

Often, however, the bonding of the glue to the substrate when certain organic layers are present on the substrate is not good and hence laser ablation is used to remove the organic layers from the substrate to allow for better bonding between the cover / encapsulating sheet and the substrate.

When the debris 116 is re-deposited on the target 110, the re-deposited debris can cause, for example, weaker bonding between the target 110 and the glue, or contaminate the target 110 thus adversely affecting the electrical / optical performance of the resulting electronic device fabricated on the target 110.

When the debris 116 is re-deposited on the window 122, the debris 116 can cause a reduction in the laser beam intensity at the ablation point, fluctuation in beam intensity at the ablation point resulting in poor uniformity in processing the materials, rapid degradation of the window, permanent window damage, and high costs associated with frequent replacing or cleaning of the window.

Images