Determination of thin film topograhpy

a thin film topography and topography technology, applied in the direction of measuring devices, instruments, using optical means, etc., can solve the problem that current thin film measurement methods do not possess such a universal appeal, and achieve the effect of improving accuracy

Inactive Publication Date: 2005-10-27
TECHNION RES & DEV FOUND LTD
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  • Summary
  • Abstract
  • Description
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Benefits of technology

[0037] Furthermore, in accordance with a preferred embodiment of the present invention, the birefringent wave-plate has optical thicknesses λφ1/2π and λφ2/2π in its two principal polarizations such that the resulting reference beams have phases differin

Problems solved by technology

Current thin film measurement methods

Method used

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  • Determination of thin film topograhpy
  • Determination of thin film topograhpy
  • Determination of thin film topograhpy

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Embodiment Construction

[0052] Interferometric techniques play an important role in the measurement of thin transparent films on substrates. The simplest interferometric method of measuring the thickness hfilm,(x,y) of a non-uniform thin film involves creating an image by superposition of beams reflected from two interfaces: air / film and film / substrate.

[0053]FIG. 1a illustrates two-beam interferometry for measuring the thickness of a thin water film 12 over a mica substrate 14. Incident light beam 10, which is either coherent or partially coherent with coherence length that is at least equal to the maximum thickness of the film (hereinafter—partially coherent), is directed onto thin film 12, and is partially reflected and partially refracted through. The refracted portion of the beam traverses through the thin film and then reflected by the water-mica interface. Absorbing grease 16 laid beneath mica substrate 14 is provided to inhibit reflections off the back surface of the mica substrate 14.

[0054] This ...

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Abstract

A method and apparatus for determining the topography of a thin film having a front surface and a back surface. The method comprises: irradiating the film with an incident coherent or partially coherent beam so as to get two reflected beams, the first reflected from the front surface, and the second from the back surface; and using a third reference beam originating from the incident beam, and substantially parallel to the two reflected beams, wherein the third reference beam acquires a controlled phase shift. The three said beams are used to create an interferometric image of the film, whereby the interference of the three beams allows acquisition of information on the topography of the film that cannot be acquired using the two reflected beams alone.

Description

FIELD OF THE INVENTION [0001] The present invention relates to determining the topography of thin films. BACKGROUND OF THE INVENTION [0002] The non-destructive nature of optical methods makes them very important tools in investigating thin films. Several interferometric and ellipsometric tools are widely used for thin film thickness measurement in industry and basic science (on ellipsometry see, for example: M. Steinberg et al, A New Method for Measurement on Surfaces and [0003] Surface Layers, Mater. Sci. and Eng., 1980, 42, 65-69. D. Beaglehole, H. K. Christenson, “Vapour adsorption on mica and silicon-entropy effects, layering and surface forces”, J.Phys.Chem.,96, 3395-3403, (1992). D. Beaglehole, “Performance of a microscopic imaging ellipsometer”, Rev.Sci.Instrum.,59,2557,(1998)). The typical thickness of films in microelectronics varies in the range of 0÷10 μm. The development of faster microelectronic devices demands development of very thin film technology and therefore new ...

Claims

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Application Information

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IPC IPC(8): G01B9/02G01B11/02G01B11/06
CPCG01B11/0675G01B9/02
Inventor LEIZERSON, ILYALIPSON, STEPHEN G.
Owner TECHNION RES & DEV FOUND LTD
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