High density memory card assembly

a memory card and high density technology, applied in the direction of printed circuit non-printed electric components, semiconductor/solid-state device details, instruments, etc., can solve the problems of more complicated package assembly procedures than those used, stacked-die package having a single defective ic device becoming completely unusable, and increasing the overall height or area consumed. , the effect of increasing the density of memory card

US20060072368A1Active Publication Date: 2006-04-06KINGSTON DIGITAL CO LTD
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Patent Information

Authority / Receiving Office
US · United States
Patent Type
Applications(United States)
Current Assignee / Owner
Publication Date
2006-04-06

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Abstract

A high density memory card assembly having application for USB drive storage, flash and ROM memory cards, and similar memory card formats. A cavity is formed through a rigid laminate substrate. First and second digital memory devices (e.g., TSOP packages or bare semiconductor dies) are located within the cavity so as to be recessed relative to the top and bottom of the substrate. The recessed first and second memory devices are arranged in spaced, face-to-face alignment with one another within the cavity. The first and second memory devices are covered and protected by respective first and second memory packages that are located on the top and bottom of the substrate. By virtue of the foregoing, the memory package density of the assembly can be increased without increasing the height or area consumed by the assembly for receipt within an existing external housing.
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Description

BACKGROUND OF THE INVENTION

[0001] 1. Field of the Invention

[0002] This invention relates generally to memory device packaging and, more particularly, to high density digital memory cards having application for USB drive storage, flash and ROM memory cards, and other memory cards of similar format.

[0003] 2. Background Art

[0004] Most conventional memory card assemblies (excluding the outside casing) include a rigid laminate substrate, such as an FR-4 printed wiring board (PWB), a controller, the required passive components, and at least one digital (e.g., flash) memory storage device in a TSOP (thin small outline package) type 1 package. The TSOP 1 packages are desirable because of their thin profile, typically only 1.2 mm high, and small overall footprint that can meet the size limitations of a memory card. While a memory card may vary in size and shape, most have limited thickness in order to be able to fit into the slot of a reader that is adapted to receive specific types of m...

Examples

Embodiment Construction

[0015] Turning now to the drawings, FIG. 1 shows a conventional memory card 10 having a rigid, solid laminate substrate 12. A first leadframe memory package 14 is connected to one side of the substrate 12, and a second leadframe memory package 16 is connected to the opposite side of the substrate 12. The overall height of the memory card 10 of FIG. 1 must be sufficiently low to fit within an external housing. By way of example, for an MMC card, the overall thickness is limited to 1.4 mm. In the conventional case, the storage capacity of memory card 10 is limited to the leadframe memory packages 14 and 16.

[0016] In accordance with a first preferred embodiment of this invention, a high density memory card assembly 20 having increased non-volatile storage capacity is shown in FIG. 2 of the drawings. The memory card assembly 20 includes either a flex or a rigid-flex substrate 22 having a cavity 24 (best shown in FIG. 3) formed therethrough. Like the conventional memory card 10 of FIG. ...