Apparatus for providing an aligned coil for an inductive head structure using a patterned seed layer
a technology of inductive head and seed layer, applied in the field of magnetic transducers, can solve problems such as limit the coil pitch
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[0033] In the following description of the exemplary embodiment, reference is made to the accompanying drawings which form a part hereof, and in which is shown by way of illustration the specific embodiment in which the invention may be practiced. It is to be understood that other embodiments may be utilized as structural changes may be made without departing from the scope of the present invention.
[0034] The present invention provides an apparatus for providing an aligned coil for an inductive head structure using a patterned seed layer. The present invention solves the above-described problems by using an aligned process where the base plate imprint is fabricated on an electrically insulating layer and the reversed image is fabricated and etched into the coil insulation material, e.g., hard bake photoresist to alleviate the problems associated with complete ion removal of the seed layer between high aspect ratio coils. The present invention would also not be prone to plating non-...
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