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Solder wall structure in flip-chip technologies

a technology of flip-chips and shells, applied in the field of flip-chip technologies, can solve problems such as corroding of shells, and achieve the effects of improving the stability and stability of the shell, and improving the stability of the shell

Inactive Publication Date: 2007-08-02
GLOBALFOUNDRIES INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

The present invention provides a semiconductor structure and a method for making it. The structure includes a first semiconductor chip with N solder bumps in direct physical contact with it, and a first solder wall on the chip's perimeter forming a closed loop around the bumps. This structure prevents corrosion of the solder bumps by carbon dioxide and water vapor in the surrounding ambient. Additionally, the invention includes a crack stop on the chip's perimeter, which further prevents corrosion. A module substrate is also included in the invention.

Problems solved by technology

These solder bumps may be corroded by carbon dioxide and water vapor of the surrounding ambient environment.

Method used

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  • Solder wall structure in flip-chip technologies
  • Solder wall structure in flip-chip technologies
  • Solder wall structure in flip-chip technologies

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Embodiment Construction

[0013]FIGS. 1A-1G illustrate a fabrication method for forming a semiconductor structure 100, in accordance with embodiments of the present invention. More specifically, with reference to FIG. 1A, in one embodiment, the fabrication of the semiconductor structure 100 starts with a semiconductor chip 102 and a dicing channel region 104. The semiconductor chip 102 comprises multiple interconnect layers 106a, 106b, 106c, and 106d. There may be additional device layers in a silicon substrate of the semiconductor chip 102 beneath and coupled to the interconnect layer 106d, but these additional device layers and the silicon substrate are not shown for simplicity. In the embodiment described above, there are only four interconnect layers 106a, 106b, 106c, and 106d. In general, the semiconductor chip 102 can have N interconnect layers, wherein N is a positive integer.

[0014] In one embodiment, the top interconnect layer 106a of the semiconductor chip 102 includes (i) a dielectric layer 110a, ...

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Abstract

A structure and method for forming the same. The semiconductor structure includes a first semiconductor chip and N solder bumps in direct physical contact with the first semiconductor chip, wherein N is a positive integer. The semiconductor structure also includes a first solder wall on a perimeter of the first semiconductor chip such that the first solder wall forms a closed loop surrounding the N solder bumps.

Description

BACKGROUND OF THE INVENTION [0001] 1. Technical Field [0002] The present invention relates to flip-chip technologies, and more specifically, to a solder wall structure in flip-chip technologies. [0003] 2. Related Art [0004] In typical flip-chip technologies, solder bumps are formed on top of a chip to help bond the chip to a ceramic substrate. These solder bumps may be corroded by carbon dioxide and water vapor of the surrounding ambient environment. Therefore, there is a need for a structure (and a method for forming the same), in which the solder bumps are not corroded by carbon dioxide and water vapor of the surrounding ambient. SUMMARY OF THE INVENTION [0005] The present invention provides a semiconductor structure, comprising (a) a first semiconductor chip; (b) N solder bumps in direct physical contact with the first semiconductor chip, wherein N is a positive integer; and (c) a first solder wall on a perimeter of the first semiconductor chip such that the first solder wall for...

Claims

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Application Information

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Patent Type & Authority Applications(United States)
IPC IPC(8): H01L23/48
CPCH01L23/562H01L24/11H01L2924/0001H01L2224/13111H01L2924/014H01L2924/01006H01L2224/13099H01L2224/16H01L2924/01013H01L2924/01029H01L2924/01078H01L2924/01082H01L24/13H01L2924/01005H01L2924/00014H01L2924/15787H01L2224/05024H01L2224/05008H01L2224/05001H01L2224/05572H01L2224/05124H01L2224/05147H01L2224/056H01L24/29H01L24/73H01L2224/29011H01L2224/29035H01L2224/06131H01L24/05H01L2924/00
Inventor DAUBENSPECK, TIMOTHY H.GAMBINO, JEFFREY PETERMUZZY, CHRISTOPHER DAVIDSAUTER, WOLFGANG
Owner GLOBALFOUNDRIES INC