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Fluid pump

a technology of fluid pump and pump body, which is applied in the direction of pump components, piston pumps, non-positive displacement fluid engines, etc., can solve the problems of vibration of the engine, decrease in the durability and reliability of the semiconductor device, and achieve the effect of effectively preventing the semiconductor device from reaching a high temperatur

Inactive Publication Date: 2008-05-22
AISAN IND CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

[0008]Accordingly, it is an object of the present teachings to provide a fluid pump capable of efficiently cooling the semiconductor device, and capable of reducing the vibration transmitted to the semiconductor device.
[0010]In this fluid pump, the semiconductor device makes contact in a planar manner with the sheet member, and this sheet member makes contact in a planar manner with the partition. As a result, the heat of the semiconductor device is transmitted to the partition via the first sheet member, and is transmitted from the partition to the fluid in the pump chamber. The semiconductor device can thus be cooled efficiently. Further, the sheet member that has rubber elasticity is disposed between the semiconductor device and the partition. As a result, the amount of vibration transmitted from the partition to the semiconductor device is reduced by the sheet member, and the durability and reliability of the semiconductor device can consequently be increased.
[0012]In this fluid pump, since the semiconductor device is making thermal contact with the sheet member via the substrate, it is possible to cool the semiconductor device satisfactorily. Further, since the sheet member has rubber elasticity, it is possible to reduce the amount of vibration that is transmitted from the partition to the substrate (and to the semiconductor device).
[0014]In this fluid pump, since the stator is surrounded by the partition and the heat insulating plate, heat generated by the stator is prevented from being transmitted to the semiconductor device side. It is thus possible to effectively prevent the semiconductor device from reaching a high temperature.

Problems solved by technology

Further, in the case where the fluid pump is attached to the engine room of a motor vehicle, the vibration of the engine is transmitted, whereby the casing vibrates.
As a result, there was the problem that the vibration of the casing was also transmitted to the semiconductor device, and this caused a decrease in the durability and reliability of the semiconductor device.

Method used

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Examples

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first embodiment

[0026]A fluid pump 10 of a first embodiment of the present teachings will be described. The fluid pump 10 can be utilized to circulate cooling water for cooling an engine of a motor vehicle, and can be disposed in an engine room of the motor vehicle. As shown in FIG. 1, the fluid pump 10 comprises a lower body 12, and an upper body 50 that is fixed to the lower body 12. The lower body 12 and the upper body 50 are both molded integrally from resin material.

[0027]A cylindrical convex part 15 is formed at an upper part of the lower body 12 (at the left side in FIG. 1). A shaft attaching hole 16a is formed in a center of the convex part 15. A lower end of a shaft 46 is fixed in the shaft attaching hole 16a. An upper end part of the shaft 46 protrudes upward beyond an upper surface of the convex part 15. An impeller 43 is attached in a manner allowing rotation to the upper end part of the shaft 46. A cylinder-shaped outer wall 17 is formed at an outer circumference of the convex part 15....

second embodiment

[0048]Next, a fluid pump 100 of a second embodiment of the present teachings will be described. The fluid pump 100 can also be utilized to circulate cooling water for cooling an engine. As shown in FIG. 4, the fluid pump 100 is an inner rotor fluid pump. The fluid pump 100 comprises a lower body 112, an upper body 150 that is fixed to an upper end of the lower body 112, and a cover 116 that is fixed to a lower end of the lower body 112.

[0049]A concave part 118 is formed in approximately the center of an upper part of the lower body 112, and a convex part 121 is formed at an outer side of the concave part 118. Seen from above, the convex part 121 has a ring shape surrounding the concave part 118. The convex part 121 and the concave part 118 are disposed concentrically. A substrate housing part 114 is formed within the lower body 112. A stator housing part 121a is formed within the convex part 121. A lower end of the stator housing part 121a communicates with the substrate housing par...

third embodiment

[0054]Next, a fluid pump 200 of a third embodiment of the present teachings will be described. The fluid pump 200 can also be utilized to circulate cooling water for cooling an engine. As shown in FIG. 5, the fluid pump 200 is an outer rotor fluid pump. The fluid pump 200 comprises a lower body 212, an upper body 250 that is fixed to an upper end of the lower body 212, and a cover 216 that is fixed to a lower end of the lower body 212. An impeller 243 is disposed in an inner space (i.e., pump chamber) 220 surrounded by the lower body 212 and the upper body 250. A circuit substrate 223 is housed in the lower body 212. A ring-shaped sheet member 229 makes contact in a planar manner with an upper surface of a substrate 224 of the circuit substrate 223. An upper surface of the sheet member 229 makes contact in a planar manner with a wall of the lower body (specifically, a wall facing a lower end surface of an impeller 243). The sheet member 229 also has a high degree of thermal conducti...

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PUM

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Abstract

Fluid pump (10) comprises a casing provided with a partition separating a pump chamber and a housing chamber. Impeller (43) is disposed within the pump chamber. Stator (33), semiconductor device (25), terminal (37), and sheet member (29a) are disposed within the housing chamber. Terminal (37) electrically connects the semiconductor device to the stator. Sheet member (29a) may have rubber elasticity. Preferably, the sheet member has s a first plane surface, which makes contact in a planar manner with the semiconductor device, and a second plane surface which makes contact in a planar manner with the partition of the casing.

Description

CROSS-REFERENCE TO RELATED APPLICATION[0001]This application claims priority to Japanese Patent Application No. 2006-313363 filed on Nov. 20, 2006, the contents of which are hereby incorporated by reference into the present application.BACKGROUND OF THE INVENTION[0002]1. Field of the Invention[0003]The present invention relates to a fluid pump for circulating cooling water that can cool an engine or inverter of a motor vehicle.[0004]2. Description of the Related Art[0005]This type of fluid pump has a casing that comprises a pump chamber and a housing chamber. The pump chamber and the housing chamber are separated by a partition, such that fluid within the pump chamber does not flow into the housing chamber. An impeller is disposed within the pump chamber in a manner capable of rotation. A stator and a control device are disposed within the housing chamber. The control device has a semiconductor device and a terminal. The semiconductor device operates for converting power supplied fr...

Claims

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Application Information

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IPC IPC(8): F04B17/03
CPCF04D13/064F04D13/0673F04D13/0686F04D29/5813
Inventor NAKANISHI, SHINGO
Owner AISAN IND CO LTD
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