Heat-dissipating module
a heat dissipation module and heat dissipation technology, applied in the direction of tubular elements, semiconductor devices, semiconductor/solid-state device details, etc., can solve the problem that the heat-conductive element b>20/b> can still not provide good heat-dissipation effect, and achieve high efficiency, effective heat dissipation, and the effect of keeping the unit working at efficiency
Inactive Publication Date: 2008-08-14
LIN CHANG LIANG +3
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Benefits of technology
[0006]It is therefore a primary object of the present invention to provide an improved heat-dissipating module which is able to more effectively dissipate the heat generated by a heat-generating unit at high efficiency so as to keep the unit working at efficiency.
[0007]According to the above objects, the heat-dissipating module of the present invention includes a board-type heat-pipe and a heat-conductive construction connected therewith. The board-type heat-pipe is partially disposed on a heat-generating element for dissipating the heat. The heat-conductive construction has a connecting end in contact with the board-type heat-pipe. Via the connecting end, the heat-conductive construction is connected to a predetermined section of the board-type heat-pipe. The other section of the heat-conductive construction forms an open end. The board-type heat-pipe is composed of multiple independent heat-pipe units not communicating with each other. The heat generated by a heat-generating element can be quickly and uniformly transferred through the heat-pipe units to the heat-conductive construction for dissipating the heat at high efficiency.
Problems solved by technology
However, under such circumstance, the heat-conductive element 20 can still hardly provide good heat-dissipating effect.
Method used
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[0018]Please refer to FIG. 5. The present invention includes a board-type heat-pipe 10 and a heat-conductive construction 20. The board-type heat-pipe 10 is partially disposed on a heat-generating element 40 (as shown in FIG. 9) for dissipating the heat generated by the heat-generating element 40. The heat-conductive construction 20 has a connecting end 21 for contacting or connecting with the board-type heat-pipe 10. Via the connecting end 21, the heat-conductive construction 20 is connected to a predetermined section of the board-type heat-pipe 10. The other section of the heat-conductive construction 20 forms an open end 22. In this embodiment, the heat-conductive construction 20 includes multiple heat-conductive plates arranged around the board-type heat-pipe 10. The board-type heat-pipe 10 is composed of multiple independent heat-pipe units 11 not communicating with each other. Accordingly, the board-type heat-pipe 10 can quickly and uniformly transfer the heat for heat exchang...
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A heat-dissipating module including a board-type heat-pipe and a heat-conductive construction connected therewith. The heat-conductive construction has a connecting end in contact with the board-type heat-pipe. Via the connecting end, the heat-conductive construction is connected to a predetermined section of the board-type heat-pipe. The other section of the heat-conductive construction forms an open end. The board-type heat-pipe is composed of multiple independent heat-pipe units not communicating with each other. The heat generated by a heat-generating element can be quickly and uniformly transferred through the heat-pipe units to the heat-conductive construction for dissipating the heat at high efficiency.
Description
BACKGROUND OF THE INVENTION[0001]The present invention is related to a heat-dissipating module, and more particularly to a heat-dissipating module including a board-type heat-pipe and a heat-conductive construction connected therewith. The board-type heat-pipe is composed of multiple independent heat-pipe units not communicating with each other for dissipating the heat at high efficiency.[0002]There are various electric or electronic products which will generate heat when operating, such as refrigerators, air-conditioners, large-size electronic signs, high-speed electronic elements, etc. In general, a heat-radiating module is arranged for dissipating the heat so as to stabilize the operation of the device. An auxiliary unit with good heat-conductivity is often disposed on the heat-generating element, such as copper plates, aluminum boards, heat-pipes, etc. The heat-radiating module is attached to the surface of the heat-generating element. By means of convection, the heat is transfe...
Claims
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Login to View More IPC IPC(8): F28D15/00
CPCF28D15/0233F28D15/0266F28F1/022F28F1/24F28F3/12H01L2924/0002H01L23/427F28D15/0275H01L2924/00
Inventor LIN, CHANG-LIANGLEE, CHI-LUNGLIANG, HUI-YUANYAN, JIU-YAN
Owner LIN CHANG LIANG