Electrolytic processing unit device, and method for electrolytic processing, washing, and drying

Abstract

An electrolytic processing unit device includes an electrolytic processor for performing electrolytic processing on a wafer, a washer for washing the processed wafer, and a drier for drying the wafer. The electrolytic processor, the washer, and the drier are placed in one processing chamber to form one module. In this manner, the electrolytic processing procedure, the washing procedure, and the drying procedure for wafers can be continuously carried out in one place.

Description

BACKGROUND OF THE INVENTION[0001]1. Field of the Invention[0002]The present invention relates to an electrolytic processing unit device, and a method for electrolytic processing, washing, and drying. More particularly, the present invention relates to an electrolytic processing unit device that is used for performing electrolytic processing, washing, and drying for wafers, and a method for the electrolytic processing, washing, and drying.[0003]2. Description of the Related Art[0004]In a conventional CuCMP electrolytic polishing, for example, the series of procedures for electrolytic processing, washing, and drying for each wafer is carried out in modules that are independent of one another. Therefore, each wafer needs to be transported through the corresponding module in each of the procedures for electrolytic processing, washing, and drying. Accordingly, the number of wafer transporting procedures between the modules is large.[0005]Particularly, in the electrolytic processing for e...

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Benefits of technology

[0025]The object of the present invention is to solve the above problems. More specifically, according to the present invention, the procedures being carried out sequentially in a device are not interrupted, and the operation rate does not rapidly drop. Instead, each module performs an operation independently of other modules. If there is some trouble caused in one module, the other modules keep operating. In this manner, the entire operation rate does not rapidly drop, and a stable operation rate is kept. Also, wafer transporting devices for connecting modules for the respective procedures are not required, and an increase in device size due to the transporting devices can be prevented.

[0026]Also, according to the present invention, the atmosphere in the electrolytic processing procedure does not adversely affect the atmosphere in the later washing procedure, or particles are not scattered about. The adverse influence of the atmosphere in the electrolytic processing procedure is the problem normally expected from a combination of the electrolytic processing procedure and the washing and drying procedures by a conventional technique. The present invention also eliminates the adverse influence of the contamination caused by the Cu material that is dissolved by an electrolytic solution and adheres back to the surface. By doing so, the electrolytic solution having been used for electrolytic processing cannot be brought into the next electrolytic processing procedure and the next washing procedure.

Problems solved by technology

The adverse influence of the atmosphere in the electrolytic processing procedure is the problem normally expected from a combination of the electrolytic processing procedure and the washing and drying procedures by a conventional technique.

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