Polishing pad, use thereof and method for making the same
a technology of polishing pad and polishing surface, which is applied in the field of polishing pad, can solve the problems of uneven distribution of contents of the lower backing layer, fresh silicon to be exposed to the slurry and the polishing pad, and uneven distribution of contents of the polishing layer
Inactive Publication Date: 2008-11-20
SAN FANG CHEM IND
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Benefits of technology
[0009]One object of the present invention is to provide a polishing pad that comprises a buffer sheet, a polishing sheet and adhesive for adhering the buffer sheet to the polishing sheet. The buffer sheet comprises fibers. The polishing sheet comprises a first elastomer. The adhesive comprises a second elastomer.
[0010]Another object of the present invention is to provide a method of polishing a substrate comprising using the polishing pad described above to polish a surface of the substrate.
[0011]Still another object of the present invention is to provide a method for manufacturing the polishing pad described above comprising the steps
Problems solved by technology
Furthermore, the reacted surface is continually wiped away, causing fresh silicon to be exposed to the slurry and the polishing pad.
Because the lower backing layer of the conventional polishing pad usually comprises fibers, contents of the lower backing layer are not distributed evenly.
Also, because the polishing layer of the conventional polishing pad usually comprises elastomers, contents of the polishing layer are not distributed evenly either.
Besides, the surfaces of the lower backing layer and the polishing pad are not flat and usually rough and undulating.
Such features make it difficult for the lower backing layer or polishing pad to attach tightly and completely to the fluid-impermeable layer.
Therefore, the lifespan of the conventional polishing pad is shortened.
Method used
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[0017]The present invention is to provide a polishing pad that comprises a buffer sheet, a polishing sheet and adhesive for adhering the buffer sheet to the polishing sheet. The buffer sheet comprises fibers. The polishing sheet comprises a first elastomer. The adhesive comprises a second elastomer.
[0018]According to the invention, any buffer sheet comprising fibers can be applied in the invention. The buffer sheet preferably comprises a non-woven fabric, and more preferably, the buffer sheet comprises a rolled non-woven woven fabric. The rolled nonwoven fabric can be used in a roll-to-roll way that improves batch uniformity in comparison with a conventional method of producing a single polishing pad involving molding or casting.
[0019]As used herein, “a non-woven fabric” refers to a manufactured sheet, web or mat of directionally or randomly orientated fibers, bonded by friction, and / or cohesion and / or adhesion, excluding paper and products which are woven, knitted, tufted, stitch-b...
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The present invention mainly relates to a polishing pad that comprises a buffer sheet, a polishing sheet and adhesive for adhering the buffer sheet to the polishing sheet. The buffer sheet comprises fibers. The polishing sheet comprises a first elastomer. The adhesive comprises a second elastomer. A method of polishing a substrate comprising using the polishing pad and a method for manufacturing the polishing pad described above are also provided.
Description
BACKGROUND OF THE INVENTION[0001]1. Field of the Invention[0002]The present invention relates to a polishing pad for use in chemical mechanical polishing.[0003]2. Description of the Related Art[0004]Chemical mechanical polishing (CMP) is a procedure for planarizing the surface of a substrate with a polishing pad. CMP is generally applied in polishing lenses, mirrors, substrates of liquid crystal displays, silicon wafers, and oxidation and / or metal layers on silicon wafers.[0005]Taking silicon wafers as an example, ingots of monocrystalline silicon are sliced first. The wafers are usually lapped to make them flat for subsequently chemical etching. A polishing process is required after the etching process. During the polishing process, a polishing pad together with slurry reacts chemically with the silicon atoms on the surface of the wafer to make the reacted surface softer than the underlying silicon.[0006]Furthermore, the reacted surface is continually wiped away, causing fresh sili...
Claims
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Login to View More IPC IPC(8): B24D11/00B24D18/00
CPCB24B37/24B24D11/001
Inventor FENG, CHUNG-CHIHYAO, I-PENGCHAO, CHEN-HSIANGHUNG, YUNG-CHANG
Owner SAN FANG CHEM IND