Assembly for Extracting Heat from a Housing for Electronic Equipment

a technology for electronic equipment and housing, which is applied in the direction of electrical equipment, electrical apparatus, and electrical apparatus contruction details, etc., can solve the problems of limiting the number of racks that can be fit into a data center, the depth of the rack, and the heat generated by electronic equipment, so as to maximize the capacity of the data center rack

Inactive Publication Date: 2009-09-24
WRIGHT LINE
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

[0005]It is therefore an object of this invention to provide a rack cooling system that maintains the depth of the rack to a minimum, thus maximizing data center rack capacity.

Problems solved by technology

The electronic equipment generates substantial heat that must be dissipated.
However, such thickened panels increase the depth of the racks, which inherently limits the number of racks that can be fit into a data center.

Method used

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  • Assembly for Extracting Heat from a Housing for Electronic Equipment
  • Assembly for Extracting Heat from a Housing for Electronic Equipment
  • Assembly for Extracting Heat from a Housing for Electronic Equipment

Examples

Experimental program
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Embodiment Construction

[0031]This invention may be accomplished in an assembly for extracting heat from a housing for electronic equipment, the housing having a front, a back, two sides and a top, the assembly comprising a back for the housing that defines an open area proximate the top, and an air passageway in fluid communication with the open area in the back, to conduct heated air exiting the housing through the open area away from the housing. Typically, the front is perforated and the sides are solid, so that air flows into the housing through the front, through the electronic equipment located in the housing, and out of the housing through the open area, into the passageway.

[0032]FIGS. 1A-1C schematically depict three concepts for accomplishing the invention, which is an assembly for extracting heat from a housing for electronic equipment. In this case, housing 10 may be a computer server rack such as a “Paramount” enclosure offered by Wright Line LLC of Worcester, MA. Computer equipment rack 10 ho...

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PUM

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Abstract

An assembly for extracting heat from a housing for electronic equipment with an interior that is adapted to hold heat-generating electronic equipment, the housing having an essentially solid top portion and an essentially solid back portion. The assembly includes a first opening in the top portion of the housing that leads to the housing interior, the first opening located at the back of the top portion, proximate the back portion of the housing, a second opening in the back portion of the housing that leads to the housing interior, the second opening located at the top of the back portion, proximate the top portion of the housing, wherein the first opening is contiguous with the second opening, and a chimney external to the housing and coupled to the housing such that the chimney encompasses and is in fluid communication with the first and second openings, the chimney defining an inlet for taking in air leaving the housing through the first and second openings and an outlet for conducting the air out of the chimney.

Description

CROSS REFERENCE TO RELATED APPLICATION[0001]This application is a continuation in part of co-pending application Ser. No. 11 / 412,430, filed on Apr. 27, 2006. Priority is claimed.FIELD OF THE INVENTION[0002]This invention relates to a housing for electronic equipment with improved heat-dissipation characteristics.BACKGROUND OF THE INVENTION[0003]Electronic equipment is often located within a housing, such as an equipment rack used to hold computer servers and the like in assemblies that are located within the rack. The electronic equipment generates substantial heat that must be dissipated. Cool air typically passes through the housings to help dissipate heat. In many cases, fans located in the front door and / or back door and / or within the rack and / or in the top of the rack are used to circulate the cold air and expel the warmed air.[0004]One solution proposes a front or back rack panel that is several inches thick, and carries ducting and fans to route air through the rack. Cool air...

Claims

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Application Information

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Patent Type & Authority Applications(United States)
IPC IPC(8): H05K5/00
CPCH05K7/20745
Inventor LUCIA, DAVIDTRESH, MICHAELBENARCIK, EDWARD
Owner WRIGHT LINE
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