Image-sensing chip package module adapted to dual-side soldering

a chip and chip package technology, applied in the field of chip package modules, can solve the problems of not being fixed tightly, unable to obtain protection, and easily destroyed,

Active Publication Date: 2009-11-05
DYNA IMAGE CORPORATION
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

Enables dual-side electrical connectivity with a main PCB and protects the filter lens from external impacts by securing it within the substrate, enhancing the module's functionality and durability.

Problems solved by technology

1. The image-sensing chip package module of the prior art is soldered onto a main PCB by single-side soldering. In other words, the image-sensing chip package module only can use its bottom side to electrically connect with the main PCB. Hence, single-side soldering limits the usage scope of the image-sensing chip package module.
2. The filter lens 3a is disposed on the package colloid 2a, so that the filter lens 3a cannot obtain any protection and is destroyed easily by external impacts.
3. The filter lens 3a is disposed loosely on the package colloid 2a, i.e. the filter lens 3a is not fixed tightly and can slide easily.

Method used

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  • Image-sensing chip package module adapted to dual-side soldering
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  • Image-sensing chip package module adapted to dual-side soldering

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Embodiment Construction

[0033]Referring to FIGS. 2 and 3A to 3F, the present invention provides a method for making an image-sensing chip package module adapted to dual-side soldering, including as follows:

[0034]Step S100 is: referring to FIGS. 3A and 4, providing a first board unit 1 that has a first board 10, a plurality of first through holes 12 passing through the first board 10, and a plurality of first conductive bodies 13 respectively formed on inner surfaces of the first through holes 12 and extended from the bottom ends of the inner surfaces of the first through holes 12 to the bottom side of the first board 10. In addition, the first board 10 can be a BT (Bismaleimide Triazine) substrate.

[0035]Step S102 is: referring to FIGS. 3A and 4, arranging at least one image-sensing chip S on the first board 10 of the first board unit 1 in order to electrically connect the at least one image-sensing chip S with the first conductive bodies 13.

[0036]Furthermore, the first board 10 has a chip carrying area 100...

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Abstract

An image-sensing chip package module adapted to dual-side soldering includes three substrates, an image-sensing chip and a filter lens. The three substrates are stacked together by pressing (using adhesive as adhesion medium), and the image-sensing chip is electrically connected to the top side of the top substrate and the bottom side of the bottom substrate via conductive bodies that are formed on inner surfaces of through holes passing through the three substrates. Hence, the image-sensing chip package module can use the conductive bodies formed on the bottom side of the bottom substrate (positive face electrical conduction) or the conductive bodies formed on the top side of the top substrate (negative face electrical conduction) to electrically connect with a main PCB. Furthermore, the filter lens is received and hidden in an opening of the top substrate in order to prevent the filter lens from being slid, collided and destroyed.

Description

BACKGROUND OF THE INVENTION[0001]1. Field of the Invention[0002]The present invention relates to a chip package module, and particularly relates to an image-sensing chip package module adapted to dual-side soldering.[0003]2. Description of the Related Art[0004]Referring to FIG. 1, the prior art provides an image-sensing chip package module adapted to single-side soldering, including: a PCB (Printed Circuit Board) 1a, two conductive trace layers 10a, an image-sensing chip S, a package colloid 2a and a filter lens 3a. [0005]The two conductive trace layers 10a are formed around the PCB 1a, and the two conductive trace layers 10a are respectively extending from the top side of the PCB 1a to the bottom side of the PCB 1a. In addition, the image-sensing chip S is electrically connected to the two conductive trace layers 10a via two lead wires W.[0006]The package colloid 2a is an epoxy material, and the package colloid 2a covers the image-sensing chip S for protecting the image-sensing chi...

Claims

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Application Information

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Patent Type & AuthorityApplications(United States)
IPC IPC(8): H01L31/00
CPCH01L23/055H01L27/14618H01L27/14621H01L27/14625H01L2224/48091H01L2924/00014
InventorCHEN, MENG-KUN
OwnerDYNA IMAGE CORPORATION