Liquid cooling apparatus and method for facilitating cooling of an electronics system
a technology for electronic systems and cooling apparatuses, applied in the direction of cooling apparatus, lighting and heating apparatus, semiconductor/solid-state device details, etc., can solve the problems of difficult cooling and approach, and achieve the effect of facilitating access
Inactive Publication Date: 2010-01-07
INT BUSINESS MASCH CORP
View PDF11 Cites 42 Cited by
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Benefits of technology
The present invention provides a liquid cooling apparatus for an electronics rack that includes a rack-level coolant manifold assembly and a movable chassis-level manifold subassembly. The apparatus allows for efficient cooling of electronic components in the rack through the use of liquid coolant. The chassis-level coolant inlet manifold and the rack-level inlet manifold are connected, and the chassis-level coolant outlet manifold and the rack-level outlet manifold are also connected. The movable chassis-level manifold subassembly is slidably adjustable to facilitate access to a removable component of the electronics subsystem chassis. The technical effects of this invention include improved cooling efficiency, improved access to components for maintenance and replacement, and reduced space requirements for the cooling apparatus.
Problems solved by technology
This trend poses a cooling challenge at both the module and system level.
However, this approach is becoming problematic at the system level.
Method used
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View moreImage
Smart Image Click on the blue labels to locate them in the text.
Smart ImageViewing Examples
Examples
Experimental program
Comparison scheme
Effect test
Embodiment Construction
[0023]As used herein, the term “electronics system”, includes any housing, frame, rack, compartment, blade server system, etc., having one or more heat generating components of a computer system, and may be, for example, a stand alone computer processor having high, mid or low end processing capability. In one embodiment, an electronics system may comprise multiple electronics subsystems, each having one or more heat generating components disposed therein requiring cooling. “Electronics subsystem” refers to any blade, book, node, etc., having one or more heat generating electronic components. Electronics subsystems of an electronics system may be movable or fixed relative to the electronics system, with the blades of a blade center system being one example of subsystems of an electronics system to be cooled. In another example, the electronics system may comprise an electronics rack having one or more multi-blade center systems disposed therein, with each multi-blade center system b...
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More PUM
Login to View More Abstract
Apparatus and method are provided for facilitating liquid cooling one or more components of an electronic subsystem chassis disposed within an electronics rack. The apparatus includes a rack-level coolant manifold assembly and at least one movable chassis-level manifold subassembly. The rack-level coolant manifold assembly includes a rack-level inlet manifold and a rack-level outlet manifold, and each movable chassis-level manifold subassembly includes a chassis-level coolant inlet manifold coupled in fluid communication with the rack-level inlet manifold, and a chassis-level coolant outlet manifold coupled in fluid communication with the rack-level outlet manifold. The chassis-level manifold subassembly is slidably coupled to the electronics rack to facilitate access to one or more removable components of the electronic subsystem chassis. In one embodiment, the electronics subsystem chassis is a multi-blade center system having multiple removable blades, each blade being an electronics subsystem.
Description
TECHNICAL FIELD[0001]The present invention relates to apparatuses and methods for facilitating cooling of an electronics system, such as a multi-blade center system, and more particularly, to apparatuses and methods for facilitating liquid-cooling of selected electronic components of an electronics system without impacting serviceability of the electronics system.BACKGROUND OF THE INVENTION [0002]The power dissipation of integrated circuit chips, and the modules containing the chips, continues to increase in order to achieve increases in processor performance. This trend poses a cooling challenge at both the module and system level. Increased air flow rates are needed to effectively cool high power modules and to limit the temperature of the air that is exhausted into the computer center.[0003]In many server applications, processors along with their associated electronics (e.g., memory, disc drives, power supplies, etc.) are packaged in removable drawer or blade configurations dispo...
Claims
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More Application Information
Patent Timeline
Login to View More Patent Type & Authority Applications(United States)
IPC IPC(8): H05K7/20
CPCH05K7/20772
Inventor CAMPBELL, LEVI A.CHU, RICHARD C.CRIPPEN, MARTIN J.ELLSWORTH, JR., MICHAEL J.IYENGAR, MADHUSUDAN K.KAMATH, VINODMATTESON, JASON A.SCHMIDT, ROGER R.SIMONS, ROBERT E.
Owner INT BUSINESS MASCH CORP