Vapor chamber and supporting structure of the same

Abstract

A vapor chamber includes a casing, the working fluid, a wick structure and a supporting structure. The casing has a hollow room for allowing the working fluid to be filled therein. The wick structure is distributed in the hollow room. The supporting structure abuts against an inside surface of the wick structure. The supporting structure includes side plates and a plurality of wavelike pieces connected between the side plates. Each of the wavelike pieces is constituted of a plurality of crests and troughs. The crests of any two neighboring wavelike pieces are arranged in an alternating manner. A penetrating hole is provided at the crests and the troughs respectively. The working fluid flows through the separated passages and the penetrating holes. Via the above arrangement, the heat-conducting efficiency of the vapor chamber can be enhanced.

Description

BACKGROUND OF THE INVENTION[0001]1. Field of the Invention[0002]The present invention relates to a supporting structure, and in particular to a vapor chamber and a supporting structure of the same.[0003]2. Description of Prior Art[0004]With the increase in the operation speed of a central processing unit of a computer, it generates more and more heat. Therefore, the traditional heat-dissipating device constituted of an aluminum-extruded heat sink and a fan cannot satisfy the requirement for the operation of the central processing unit. Thus, many manufacturers develop heat pipes and vapor chambers that have larger heat-conducting performance, and combine the heat pipes and vapor chamber with the heat sink, thereby solving the current problems relating to heat dissipation. Among these heat-dissipating means, more and more manufactures pay attention to and devote themselves to the development of vapor chambers because the vapor chamber has a large area that is brought into direct cont...

AI Technical Summary

Benefits of technology

"The present invention provides a vapor chamber with a supporting structure that enhances heat conduction efficiency. The supporting structure can be designed into various modular sub-structures to reduce production costs. The alternating arrangement of crests on neighboring wavelike pieces ensures uniform force exerted on the vapor chamber and prevents collapsing and deformation. The vapor chamber includes a casing, a wick structure, and a supporting structure. The wick structure is distributed in the hollow room and the supporting structure abuts against an inside surface of the wick structure. The wavelike pieces are constituted of crests and troughs, and the crests of any two neighboring wavelike pieces are arranged in an alternating manner. A penetrating hole is provided at the crests and the troughs."

Problems solved by technology

Therefore, the traditional heat-dissipating device constituted of an aluminum-extruded heat sink and a fan cannot satisfy the requirement for the operation of the central processing unit.

Since the heat-conducting path is relatively long, the heat-conducting efficiency of the vapor chamber becomes poor, which also affects the heat-conducting performance of the heat-generating element.

Therefore, it is an important issue to overcome the drawbacks of prior art.

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