Embedded chip substrate and fabrication method thereof
a chip substrate and chip technology, applied in the field of substrates, can solve the problems of deteriorating the miniaturization of electronic products, and the similarity of circuit boards used in chip packages
Inactive Publication Date: 2010-01-28
ADVANCED SEMICON ENG INC
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- Abstract
- Description
- Claims
- Application Information
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Benefits of technology
[0029]In order to make the above and other features and advantages of the present invention mo
Problems solved by technology
As such, the area occupied by the circuit board is inevitably increased as well, which deteriorates miniaturization of the electronic products.
In addition, the circuit boards used in chip packages also encounter the similar issue.
Method used
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[0035]FIGS. 1A through 1L are schematic cross-sectional flowcharts illustrating a process of manufacturing an embedded chip substrate according to an embodiment of the present invention. FIGS. 2A and 2B are schematic cross-sectional flowcharts illustrating a process of manufacturing an embedded chip substrate according to another embodiment of the present invention. FIG. 3 is a schematic cross-sectional flowchart illustrating a process of manufacturing an embedded chip substrate according to still another embodiment of the present invention.
[0036]First, referring to FIG. 1A, a core layer 10 is provided. The core layer 10 includes a core dielectric layer 12 and two conductive layers 14 that are disposed at opposite sides of the core dielectric layer 12, respectively. The core dielectric layer 12 can be an insulation board. Additionally, in other embodiments that are not depicted in the drawings, a multi-layered board can serve as a substitute for the core dielectric layer 12 of the p...
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Abstract
An embedded chip substrate includes a first insulation layer, a core layer, a chip, a second insulation layer, a first circuit layer, and a second circuit layer. The core layer disposed on the first insulation layer has an opening that exposes a portion of the first insulation layer. The chip is adhered into a recess constructed by the opening and the first insulation layer. The second insulation layer is disposed on the core layer for covering the chip. The first circuit layer is disposed at the outer side of the first insulation layer located between the first circuit layer and the core layer. The second circuit layer is disposed at the outer side of the second insulation layer located between the second circuit layer and the core layer. The first circuit layer is electrically connected to the second circuit layer that is electrically connected to the chip.
Description
CROSS-REFERENCE TO RELATED APPLICATION[0001]This application claims the priority benefit of Taiwan application serial no. 97127864, filed on Jul. 22, 2008. The entirety of the above-mentioned patent application is hereby incorporated by reference herein and made a part of this specification.BACKGROUND OF THE INVENTION[0002]1. Field of the Invention[0003]The present invention generally relates to a substrate and a fabrication method thereof. More particularly, the present invention relates to an embedded chip substrate and a fabrication method thereof.[0004]2. Description of Related Art[0005]With recent progress of electronic technologies, electronic products that are more user-friendly and with better functions are continuously developed. Further, these products are designed to satisfy requirements for lightness, slimness, shortness, and compactness. In a housing of the electronic product, a circuit board is often disposed for carrying various electronic elements. The electronic ele...
Claims
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Patent Timeline
Login to View More IPC IPC(8): H05K1/16H05K1/11H05K3/30H01R43/16
CPCH01L23/5389Y10T29/4913H01L24/82H01L2224/24227H01L2224/73267H01L2224/92244H01L2924/01029H01L2924/01079H01L2924/15153H01L2924/1517H05K1/185H05K1/188H05K3/429H05K3/4602H05K3/4652H05K2201/09536H05K2201/10674H05K2203/063H01L24/24Y10T29/49204Y10T29/49213H01L2224/32225H01L2924/01005H01L2924/01033H01L2924/014H01L2224/04105H01L21/4857H01L21/486H01L23/49822H01L23/49827H01L23/49838
Inventor WANG, YUNG-HUIOU, YING-TE
Owner ADVANCED SEMICON ENG INC