Method for packaging micro electromechanical systems microphone

a micro electromechanical system and microphone technology, applied in the field of methods, can solve the problems of difficult manufacturing of ecms, inability to manufacture ecms with surface mount technology, and conventional method takes a lot of time on packaging mems microphones, so as to save production time and cos
US20100175242A1Inactive Publication Date: 2010-07-15TONG HSING ELECTRONICS IND LTD
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Patent Information

Authority / Receiving Office
US · United States
Patent Type
Applications(United States)
Current Assignee / Owner
TONG HSING ELECTRONICS IND LTD
Publication Date
2010-07-15
Estimated Expiration
Not applicable · inactive patent

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Abstract

A method for packaging micro electromechanical systems (MEMS) microphone has steps of providing a base, arranging and mounting multiple microphone component assemblies on the base, providing a frame, mounting the frame on the base, forming multiple microphone units, providing a cover; mounting the microphone units on the cover and forming multiple MEMS microphones. Therefore, the MEMS microphones can be produced once in large quantities to save production time and costs.
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Description

BACKGROUND OF THE INVENTION

[0001] 1. Field of the Invention

[0002] The present invention relates to a method, and more particularly to a method for packaging micro electromechanical systems (MEMS) microphone to produce MEMS microphones in large quantities.

[0003] 2. Description of Related Art

[0004] The advancement of the electronic technology has resulted in most electronic devices being lighter, thinner, shorter and smaller. Micro electromechanical system (MEMS) is commonly used because productions manufactured by MEMS technique are in micrometer size.

[0005] For example, MEMS microphones have gradually replaced conventional electric condenser microphones (ECMs). The ECMs have low heat resistance so the ECMs cannot be manufactured with surface mount technology (SMT) and ECMs are difficult to be manufactured. Contrariously, the MEMS microphones have high heat resistance. The MEMS microphones can be manufactured with SMT to simplify the manufacture process of the MEMS microphones.

[0006] Howev...

Claims

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