Heat dissipation apparatus

Abstract

A heat dissipation apparatus includes a base with a bottom surface contacting a heat source, and a fin assembly disposed on a top surface of the base. The fin assembly includes a first heat dissipation member, and a second heat dissipation member symmetric with respect to a centerline of the fin assembly. Each heat dissipation member comprises a plurality of parallel fins vertically disposed on a top surface of the base, and a heat pipe passing through the plurality of parallel fins.

Description

BACKGROUND[0001]1. Technical Field[0002]The present disclosure relates to a heat dissipation apparatus.[0003]2. Description of Related Art[0004]Electronic devices in computers, such as central processing units (CPUs), generate considerable heat during normal operation, which can deteriorate operational stability and damage associated electronic devices. Thus, the heat must be removed quickly to ensure normal operation of the CPU. A typical heat dissipation apparatus includes a typical heat sink mounted on a CPU to remove heat, and a fan fixed on the heat sink to generate airflow through the heat dissipation apparatus. A commonly used heat dissipation apparatus may be a downflow type with the fan disposed on top of the heat sink or a sideflow type with the fan disposed at a side of the heat sink. The downflow type heat sink includes a plurality of parallel fins soldered together and a copper core disposed in the middle of the parallel fins for heat conduction. However, the copper cor...

AI Technical Summary

Benefits of technology

[0004]Electronic devices in computers, such as central processing units (CPUs), generate considerable heat during normal operation, which can deteriorate operational stability and damage associated electronic devices. Thus, the heat must be removed quickly to ensure normal operation of the CPU. A typical heat dissipation apparatus includes a typical heat sink mounted on a CPU to remove heat, and a fan fixed on the heat sink to generate airflow through the heat dissipation apparatus. A commonly used heat dissipation apparatus may be a downflow type with the fan disposed on top of the heat sink or a sideflow type with the fan disposed at a side of the heat sink. The downflow type heat sink includes a plurality of parallel fins soldered together and a copper core disposed in the middle of the parallel fins for heat conduction. However, the copper core is usually heavy and dissipating efficiency thereof low.

Problems solved by technology

Electronic devices in computers, such as central processing units (CPUs), generate considerable heat during normal operation, which can deteriorate operational stability and damage associated electronic devices.

However, the copper core is usually heavy and dissipating efficiency thereof low.

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