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Ballistic-resistant panel including high modulus ultra high molecular weight polyethylene tape

a technology of polyethylene tape and high modulus, applied in the field of survivability enhancement, can solve the problems of generally negatively affecting the effectiveness of conventional ballistic-resistant panels, and higher adhesive ratios, and achieve the effects of reducing the reducing the effect of adhesive to uhmwpe ratio, and increasing the adhesive ratio

Active Publication Date: 2011-07-14
DUPONT SAFETY & CONSTR INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

The invention is a ballistic-resistant panel made of high modulus polyethylene tape. This panel has improved ballistic resistance compared to panels made entirely of conventional ballistic fibers and is also more cost-effective. The use of monolithic UHMWPE tape provides structural support and reduces delamination after a ballistic event. The adhesive used in the panel is significantly lower than that required for conventional panels, which negatively affects the effectiveness of conventional panels due to higher adhesive ratios. Overall, this invention offers improved ballistic resistance at a lower cost.

Problems solved by technology

The effectiveness of conventional ballistic-resistant panels is generally negatively affected by the higher adhesive ratios, as the adhesive portion adds weight to the laminate but does not contribute to the ballistic resistance unless the adhesive is specifically designed to produce controlled delamination.

Method used

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  • Ballistic-resistant panel including high modulus ultra high molecular weight polyethylene tape
  • Ballistic-resistant panel including high modulus ultra high molecular weight polyethylene tape
  • Ballistic-resistant panel including high modulus ultra high molecular weight polyethylene tape

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Embodiment Construction

[0022]The present invention relates to ballistic laminates having a plurality of layers of high modulus material, either all or some portion of which layers are constructed of non-fibrous, high modulus, ultra high molecular weight polyethylene tape of the type described in U.S. patent application Ser. No. 11 / 787,094, filed on Apr. 13, 2007, the contents of which are incorporated herein in their entirety by reference thereto. The non-fibrous, high modulus, UHMWPE tape is produced by Tensylon High Performance Materials, Inc. of Monroe, N.C., and sold under the name TENSYLON®. As used in this application, the term “high modulus” refers to materials having a modulus greater than 1,000 grams per denier (gpd).

[0023]In order to form an improved strike-face for a ballistic-resistant panel according to the present invention, adhesive was applied to one side of a plurality of webs of unidirectional UHMWPE tape. The webs of adhesive-coated unitape were bonded into a unidirectional or unitape s...

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Abstract

A ballistic-resistant panel in which the entire panel or a strike-face portion thereof is formed of a plurality of sheets of high modulus high molecular weight polyethylene tape. The sheets of high modulus polyethylene tape can be in the form of cross-plied laminated layers of tape strips or a woven fabric of tape strips. The strips of UHMWPE tape include a width of at least one inch and a modulus of greater than 1400 grams per denier. The ballistic-resistant panel may include a backing layer of conventional high modulus fibers embedded in resin. A wide variety of adhesives were found acceptable for bonding the cross-plied layers of high modulus polyethylene tape together for forming the ballistic-resistant panels of the present invention.

Description

[0001]This application is a Continuation-In-Part of U.S. patent application Ser. No. 11 / 821,659, filed on Jun. 25, 2007 and entitled “Non-Fibrous High Modulus Ultra High Molecular Weight Polyethylene Tape for Ballistic Applications” and is a Continuation-In-Part of U.S. patent application Ser. No. 11 / 787,094, filed on Apr. 13, 2007 and entitled “Wide Ultra High Molecular Weight Polyethylene Sheet and Method of Manufacture”, of which the entire contents of said applications are incorporated herein in their entirety by reference thereto.FIELD OF THE INVENTION[0002]The present invention relates to survivability enhancement and more particularly to a ballistic laminate constructed of a plurality of layers of non-fibrous high modulus ultra high molecular weight polyethylene.BACKGROUND OF THE INVENTION[0003]Survivability enhancement is a well-known objective for armored vehicles or fixed or mobile armored structures in a combat or other high threat environment. If a high-energy projectile...

Claims

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Application Information

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Patent Type & Authority Applications(United States)
IPC IPC(8): F41H5/04
CPCB29C33/68Y10T428/2913B29C70/202B29K2023/0683B29K2223/0683B29K2995/0089B32B5/26B32B7/12B32B27/32B32B37/1207B32B2307/558F41H5/0478B32B5/022B32B27/08B32B27/12B32B2255/02B32B2255/26B32B2260/023B32B2260/046B32B2571/02F41H5/0485Y10T428/24479Y10T428/24074Y10T428/2495B29C70/04Y10T442/2623
Inventor LYONS, FIELDER STANTONMEARS, JEFFREY A.WEEDON, GENE C.HARDING, KENNETH C.OWEN, LISARUSSELL, PETER ANTHONYMITCHELL, JOSEPH
Owner DUPONT SAFETY & CONSTR INC
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