Heat dissipation apparatus with heat pipe

Abstract

A heat dissipation apparatus includes an evaporator receiving heat from a heat source, a condenser releasing the heat of the heat source, and a pipeline inter connecting the evaporator and the condenser. The condenser defines a flat rectangular chamber therein. A working fluid is contained in the evaporator. The working fluid vaporizes upon receiving the heat of the heat source. The pipeline conducts the vaporized working fluid from the evaporator to the condenser. The vaporized working fluid condenses upon releasing the heat in the chamber.

Description

BACKGROUND[0001]1. Technical Field[0002]The present disclosure generally relates to heat dissipation, and particularly to a heat dissipation apparatus with a heat pipe.[0003]2. Description of Related Art[0004]A typical heat pipe often used for heat dissipation includes a vacuum casing containing a working fluid. Preferably, a wick structure is provided inside the heat pipe, lining an inner wall of the casing. The heat pipe has an evaporating section for absorbing heat from a heat source such as a heat-generating electronic component, and a condensing section for releasing the heat absorbed by the evaporating section. When the heat is introduced to the heat pipe at the evaporating section thereof, the working fluid contained therein absorbs the heat and vaporizes. Due to the difference in vapor pressure between the two sections of the heat pipe, the generated vapor moves, bearing the heat, towards the condensing section. The vapor is condensed at the condensing section, whereby the h...

AI Technical Summary

Benefits of technology

The present patent is about a heat dissipation apparatus that uses a heat pipe with a wick structure to transfer heat from an electronic component to a heat sink. The technical effect of the patent is to improve the contact area between the heat sink and the heat pipe, accelerating the speed at which the heat is transferred from the evaporator to the condensing section of the heat pipe. The patent proposes a heat dissipation apparatus that includes an evaporator, a condenser, a pipeline, and two heat sinks attached on two opposite sides of the condenser. The apparatus has a vacuum inside, which helps to quickly evaporate the working fluid in the evaporator. The vapor moves through the pipeline due to the difference in vapor pressure between the evaporator and the condenser, and the heat is transferred to the heat sink for dissipation.

Problems solved by technology

However, such changes normally destroy the wick structure of the heat pipe and increase a flow resistance of the vapor in the heat pipe.

This negative effect reduces the speed at which the condensate can reach the evaporating section of the heat pipe.

If the condensate is not promptly returned to the evaporating section, the heat pipe will suffer drying.

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