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Structure of heat plate

a technology of heat plate and structure, which is applied in the direction of indirect heat exchangers, lighting and heating apparatus, etc., can solve the problems of often large amount of heat generated by electronic devices, and achieve the effects of improving the temperature reduction efficiency of the heat plate, improving the uniform distribution of working fluid, and increasing the diffusion efficiency of vapor of working fluid

Inactive Publication Date: 2012-02-09
KUNSHAN JUZHONG ELECTRONICS
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

"The present invention provides a structure of heat plate that improves temperature reduction efficiency. This is achieved by using two boards that mate and are coupled to each other to define an accommodation chamber. The structure also includes a plurality of first capillary layers that are arranged in the accommodation chamber in a way that they form a plurality of passages. This increases the efficiency of diffusion of vapor of a working fluid and improves the uniformity of distribution of the working fluid, resulting in improved efficiency of temperature reduction. The technical effects of this structure include practicality, novelty, improvement, and convenience."

Problems solved by technology

An electronic device often generates a great amount of heat during a long term operation.

Method used

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  • Structure of heat plate
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Embodiment Construction

[0017]With reference to the drawings and in particular to FIGS. 1A-3, which respectively show an exploded view and an assembled perspective view of a structure of heat plate according to a first embodiment of the present invention and exploded views of structures of heat plate according to second and third embodiments of the present invention, the heat plate constructed in accordance with the present invention comprises two boards 100, a sealing tube 110, and a plurality of first capillary layers 210, and is provided for installation on an electronic device to realize functions of lowering temperature of a heat source, performing effective heat transfer, and improving temperature reduction efficiency.

[0018]The two boards 100 are mated and coupled to each other so that the two boards 100 defined an accommodation chamber 101 therebetween. In a practical arrangement, one of the two boards 100 can be structured to form a recess 102, or alternatively, both boards 100 are structured to fo...

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Abstract

A structure of heat plate includes two boards, which mate and are coupled to each other to define therebetween an accommodation chamber and a plurality of capillary layers arranged in the accommodation chamber in such a way that the capillary layers are set on a common horizontal plane and the capillary layers form therebetween a plurality of passages. As such, the efficiency of diffusion of vapor of a working fluid is increased and the uniformity of distribution of the working fluid is improved, so that the efficiency of temperature reduction is improved.

Description

FIELD OF THE INVENTION[0001]The present invention relates to a structure of heat plate, and in particular to a structure of heat plate applicable to an electronic device.BACKGROUND OF THE INVENTION[0002]An electronic device often generates a great amount of heat during a long term operation. A common solution for handling such a great amount of heat is installation of a heat plate that dissipates the heat. A heat plate is advantageous in respect of high heat conductivity, light weight, and simple construction and can carry out transfer of a large amount of heat without consuming electrical power.[0003]A conventional heat plate structurally comprises a board, which has a hollow interior forming a chamber that receives and retains therein a capillary tissue and is filled with a working fluid. Mounted to one side of the board is a sealing tube (or referred to an opening sealing tube, a degassing tube, or a filling and degassing tube), which has an end mounted to the board and communica...

Claims

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Application Information

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Patent Type & Authority Applications(United States)
IPC IPC(8): F28D15/04
CPCF28D15/046
Inventor HUANG, YU-POKUO, TUNG-JUNG
Owner KUNSHAN JUZHONG ELECTRONICS
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