Unlock instant, AI-driven research and patent intelligence for your innovation.

Heat dissipating device

a heat dissipating device and heat dissipation technology, which is applied in the direction of semiconductor devices, lighting and heating apparatus, basic electric elements, etc., can solve the problems of insufficient heat exchange efficiency, reduced computer system performance, and high cost, so as to achieve effective improvement of heat exchange efficiency of heat dissipating devices and material cost and the number of components.

Inactive Publication Date: 2012-05-24
INVENTEC CORP
View PDF10 Cites 3 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

[0011]The upper cover recessions or the lower cover recessions may be directly formed on the upper fan cover or the lower fan cover by stamping, thus the material cost and the number of components can be reduced. The heat

Problems solved by technology

If the waste heat produced in the operation of the computer system is not removed, the computer system performance would be reduced or even a computer system crash or damage may be caus

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Heat dissipating device
  • Heat dissipating device
  • Heat dissipating device

Examples

Experimental program
Comparison scheme
Effect test

first embodiment

[0019]Referring to FIG. 1, FIG. 1 is a schematic diagram of a heat dissipating device according to the present invention. The heat dissipating device 100 includes a fan body 110, an upper fan cover 120, and a lower fan cover 130. The upper fan cover 120 and the lower fan cover 130 are assembled on the fan body 110 to protect the fan body 110, and are convenient to be assembled. The fan body 110 has an airflow outlet 112. The upper fan cover 120 has an upper cover front portion 122 and plural upper cover recessions 124. The upper cover recessions 124 are disposed at the upper cover front portion 122 and located in front of the airflow outlet 112. A material of the upper fan cover 120 and the lower fan cover 130 may be a metal with a good thermal conductivity, such as copper or aluminum.

[0020]Each of the upper cover recessions 124 has a first bottom 126 and two first side walls 128 located on two sides of the first bottom 126. Each of the upper cover recessions 124 has an approximatel...

second embodiment

[0024]Referring to FIG. 2, FIG. 2 is a schematic diagram of a heat dissipating device according to the present invention. The heat dissipating device 100 includes the fan body 110, the upper fan cover 120, and the lower fan cover 130. The upper fan cover 120 and the lower fan cover 130 are assembled on the fan body 110 to protect the fan body 110 and are convenient to be assembled. The fan body 110 has the airflow outlet 112. The upper fan cover 120 has the upper cover front portion 122 and plural upper cover recessions 124 located at the upper cover front portion 122. The lower fan cover 130 has the lower cover front portion 132 and plural lower cover recessions 134 located at the lower cover front portion 132. The upper cover recessions 124 and the lower cover recessions 134 are located in front of the airflow outlet 112. The material of the upper fan cover 120 and the lower fan cover 130 may be a metal with a good thermal conductivity, such as copper or aluminum.

[0025]Each of the...

third embodiment

[0030]Referring to FIG. 3, FIG. 3 is a schematic diagram of a heat dissipating device according to the present invention. The heat dissipating device 100 includes the fan body 110, the upper fan cover 120, and the lower fan cover 130. The upper fan cover 120 and the lower fan cover 130 are assembled on the fan body 110 to protect the fan body 110 and are convenient to be assembled. The fan body 110 has the airflow outlet 112. The upper fan cover 120 has the upper cover front portion 122 and plural upper cover recessions 124. The upper cover recessions 124 are disposed at the upper cover front portion 122 and located in front of the airflow outlet 112. The material of the upper fan cover 120 and the lower fan cover 130 may be a metal with a good thermal conductivity, such as copper or aluminum.

[0031]Each of the upper cover recessions 124 has the first bottom 126 and two first side walls 128 located on two sides of the first bottom 126. Each of the upper cover recessions 124 has an ap...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

A heat dissipating device is disclosed, which includes a fan body, an upper fan cover, and a lower fan cover. The upper fan cover and the lower fan cover are assembled on the fan body. The fan body has an airflow outlet. The upper fan cover includes an upper cover front portion, and plural upper cover recessions disposed at the upper cover front portion. The upper cover recessions are located in front of the airflow outlet.

Description

RELATED APPLICATIONS[0001]This application claims priority to Taiwan Application Serial Number 099140008, filed Nov. 19, 2010, which is herein incorporated by reference.BACKGROUND[0002]1. Field of Invention[0003]The present invention relates to a heat dissipating device. More particularly, the present invention relates to a fan structure.[0004]2. Description of Related Art[0005]A computer system (e.g. personal computer, server host etc.) produces waste heat in operation. With the increase of computer system efficiency, the waste heat produced by the computer system in operation is greatly increased accordingly. If the waste heat produced in the operation of the computer system is not removed, the computer system performance would be reduced or even a computer system crash or damage may be caused. Therefore, a heat dissipating device is needed for removing the waste heat produced by the computer system in operation.[0006]In general, the heat dissipating device in the computer system ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): F28D15/02F28F13/12
CPCF28D15/02F28D15/0233H01L23/427H01L23/467H01L2924/0002H01L2924/00
Inventor WANG, FENG-KUCHEN, HUA-FONGHUANG, TING-CHIANGSYU, SHENG-JIECHUNG, CHIH-KUANGKUO, KAI-LIN
Owner INVENTEC CORP