Wafer level lens, production method of wafer level lens, and imaging unit

Abstract

A sufficient light-shielding property is obtained by a wafer level lens having at least one lens module having a substrate and a plurality of lenses formed on the substrate in which the wafer level lens has a black resist layer formed on the surface of the lens module or on the surface of the substrate and the black resist layer is formed with a pattern having an opening at a part intersecting the optical axis of the lens, and generation of defects such as ghosts, flares and the like due to a reflected light can be prevented and an increase in the production cost can be suppressed.

Description

TECHNICAL FIELD[0001]The present invention relates to a wafer level lens, a production method of a wafer level lens, and an imaging unit.BACKGROUND ART[0002]Presently, a portable terminal of electronic instruments such as cellular phones, PDAs (Personal Digital Assistants) and the like is loaded with a small and thin imaging unit. Such an imaging unit is generally equipped with a solid state imaging device such as a CCD (Charge Coupled Device) image sensor, a CMOS (Complementary Metal-Oxide Semiconductor) image sensor and the like, and a lens for forming a subject image on the solid state imaging device.[0003]With reduction in size and thickness of a portable terminal, reduction in size and thickness of an imaging unit is requested. For lowering the cost of a portable terminal, an efficient production process is desired. As the method of producing a lot of such small lenses, there is known a method in which a wafer level lens having a constitution containing a plurality of lenses mo...

AI Technical Summary

Benefits of technology

[0009]Originally, the wafer level lens has a big profit of suppressing production cost since a plurality of lenses are simultaneously molded on a substrate, and the substrate is diced and connected to a semiconductor substrate carrying thereon an imaging device, and the like. However, if a light shielding member is separately attached, an increase in the production cost corresponding to this process is inevitable.

[0026]The present invention is capable of providing a wafer level lens with which a sufficient light shielding property is obtained, generation of defects such as ghosts, flares and the like due to a reflected light can be prevented, and an increase in the production cost can be suppressed; a production method of a wafer level lens, and an imaging unit.

Problems solved by technology

Owing to this constitution, if a wafer level lens is diced and placed on an imaging device to give an imaging unit and when light transmission and reflection occur at a region other than the lens surface of the lens, there is a fear of tendency of defects in optical performances such as ghosts and flares in taking an image.

However, if a light shielding member is separately attached, an increase in the production cost corresponding to this process is inevitable.

Images