Heat dissipation module

Abstract

A heat dissipation module, which comprises a heat dissipation piece, a fan, a heat conduction coating material and a heat conduction piece, is disclosed. The heat conduction coating material is used for improving the thermal radiation coefficient of the heat dissipation piece. Accordingly, when elements transmit heat to the heat dissipation piece via the heat conduction piece, more heat is transmitted to the air via thermal radiation manner. Next, the fan sucks heated air to achieve the effect of heat dissipation.

Description

CROSS-REFERENCE TO RELATED APPLICATION[0001]This application claims the benefit of Taiwan Patent Application No. 100106721, filed on Mar. 1, 2011, in the Taiwan Intellectual Property Office; the disclosure of which is incorporated herein by reference.BACKGROUND OF THE INVENTION[0002]1. Field of the Invention[0003]The present invention relates to a heat dissipation module, and more particularly to a heat dissipation module having heat conduction coating material.[0004]2. Description of the Related Art[0005]A conventional heat dissipation module is composed of a heat dissipation piece, a heat conduction piece, a heat dissipation pipe, heat dissipation fins and a fan. Generally, the heat dissipation module can be disposed near heat sources inside a laptop computer such as a central processor, a motherboard, a display card, an optical disc drive, chips or hard drives. These elements inside the laptop computer may generate heat to raise temperature during the operation. If the temperatur...

AI Technical Summary

Benefits of technology

[0007]The heat dissipation module of the present invention comprises a heat dissipation piece, a fan, a heat conduction coating material and a heat conduction piece, wherein the heat conduction piece is located at a surface of the heat dissipation piece, and heating elements are disposed on the heat conduction piece. Heat generated by the heating elements can be transmitted to the heat dissipation piece via the heat conduction piece. The heat conduction coating material is formed on the heat dissipation piece to improve the thermal radiation coefficient of the heat dissipation piece. In addition, one side of the heat dissipation piece is disposed with the fan for sucking hot air. In addition, in the heat dissipation module of the present invention, a foam or a heat conduction foam can be disposed on the heat conduction coating material. The heat conduction foam is formed by encapsulating the heat conduction material on the outer layer of the foam to improve the efficiency of transmitting heat. An air channel is formed by incorporating the foam or the heat conduction foam with another foam or the heat conduction foam. In addition, to improve the effect of expelling heat, the fan can be designed to comprise an air inlet and an air outlet for expelling hot air.

[0008]The heat dissipation module of the present invention has the following advantages:

[0009](1) The heat dissipation module of the present invention forms the heat conduction coating material on the heat dissipation piece and may selectively use or dispense the use of the heat conduction pipe and the heat dissipation fins so that the design of the heat dissipation route of the heat dissipation module can have more flexibility and require less space.

[0010](2) The heat dissipation module of the present invention can have the air channel so that hot air can be easily expelled.

Problems solved by technology

These elements inside the laptop computer may generate heat to raise temperature during the operation.

If the temperature inside the laptop computer is too high, it may cause the laptop malfunctioned.

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