Metal etching method, metal etching control method and control device thereof

Abstract

Disclosed is a metal etching method, a metal etching control method and a control device thereof. The metal etching control method is employed in a metal wet etching machine and comprises steps below: performing etching to a metal film and acquiring an etching end time of the metal film; multiplying the etching end time with a constant ratio to acquire the over etching time of the metal film; and performing etching to the metal film with the over etching time to complete the etching to the metal film. The present invention can precisely judge a total real etching time needed for each of a batch of metal films as performing metal etching to the metal films to reduce the issue of unstable etching qualities as the metal film thicknesses are not regular.

Description

CROSS REFERENCE TO RELATED APPLICATION[0001]This is a division of a U.S. patent application Ser. No. 13 / 219,696, filed on Aug. 28, 2011, the disclosure of which is incorporated by reference herein.BACKGROUND OF THE INVENTION[0002]1. Field of the Invention[0003]The present invention generally relates to a metal etching method, a metal etching control method and a control device thereof, and more particularly to a metal etching method, a metal etching control method and a control device thereof which can precisely judge a total real etching time needed for each of a batch of metal films as performing metal etching to the metal films.[0004]2. Description of Prior Art[0005]Please refer to FIG. 1, which shows a diagram of that a substrate 100 carrying a metal film is conveyed in a metal wet etching machine 1 when LCD panel is manufactured. In the LCD panel manufacture, the metal wet etching machine 1 is used for executing a wet etching to the metal film. The metal wet etching process is ...

AI Technical Summary

Benefits of technology

This approach allows for precise determination of the total real etching time for each metal film, reducing unstable etching quality and improving the yield in LCD panel manufacturing by ensuring that all films are etched appropriately based on their thickness.

Problems solved by technology

However, some drawbacks still exist in the aforesaid method.

Under such circumstance, if the etching with the same total real etching time is performed to each of the metal films, the thinner metal film will be over etched and the thicker metal film will not be etched enough and consequently results in the unstable etching quality.

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